Senior Scientist, Electroplating (Hsinchu ChuTung Office)

SUMMARY OF POSITION SCOPE: We are seeking an experienced and innovative Senior Scientist with a strong background in electroplating chemistry to lead the development of advanced electroplating solutions for next-generation semiconductor & advanced packaging technologies. This role will focus on designing and optimizing electroplating baths - including copper for damascene, alloys and tin-silver systems - to enhance performance in damascene and wafer level packaging processes. As a key member of our application-R&D team, you will collaborate closely with both internal teams and external partners, including top-tier semiconductor manufacturers like TSMC. Your expertise in electroplating chemistry, complexation chemistry, and electrochemical testing will drive the development of innovative solutions that push the boundaries of semiconductor manufacturing. ESSENTIAL FUNCTIONS AND RESPONSIBILITIES: • Develop Advanced Electroplating Solutions: Design, formulate, and optimize electroplating baths with a focus on damascene copper, alloy and tin-silver systems for advanced semiconductor technologies. • Collaborate on Co-Development Projects: Work directly with external R&D teams (including TSMC) and internal U.S. teams to co-develop high-performance electroplating products. • Optimize Bath Performance: Investigate and enhance the stability, filling capabilities, uniformity, and material science properties of electroplated films through in-depth analysis • Conduct Experimental Research: Perform hands-on beaker plating, structural analysis, and electrochemical testing (such as cyclic voltammetry) to validate and refine formulations. • Troubleshooting and Technical Support: Provide expert support for resolving electroplating-related challenges in both R&D and production environments. • Documentation and Reporting: Prepare comprehensive technical reports, including research findings, experimental procedures, and development progress, for both internal and external stakeholders. • Stay Ahead of Industry Trends: Continuously monitor and leverage emerging technologies and advancements in colloidal, alloy and complexation chemistry to drive innovation in electroplating formulations. REQUIRED DEGREES, SKILLS and EXPERIENCE: • Ph.D. in Chemistry, Chemical Engineering, or a related field with a focus on electrochemistry, colloidal chemistry, or complexation chemistry. • Very strong technical writing and English communication skills - ability to prepare detailed reports and effectively communicate findings. • Hands-on experience in electroplating and electrochemical processes, with a deep understanding of the ECP process in damascene and wafer level packaging. • Strong background in organic & inorganic chemistry, especially as applied to electroplating product. • Proven ability to collaborate in a co-development environment, working with external partners like TSMC and U.S. R&D teams. • Familiarity with electrochemical testing methods, such as cyclic voltammetry (CV), and other characterization techniques is a plus. BEHAVIORAL COMPETENCIES: • Self-motivated with a strong initiative to drive independent research and product development. • Excellent problem-solving skills • Ability to collaborate effectively with cross-functional teams. • Strong attention to detail, with the ability to manage multiple projects and meet tight deadlines in a fast-paced environment. • Excellent communication skills, including the ability to present complex technical data in an accessible way for both internal and external audiences. • Proactive, flexible, and able to adapt to new challenges as the semiconductor industry evolves.