【BU】HBM Ecosystem Manager - 2.5D SIP & Packaging

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Taipei---MTT-office-Taiwan/HBM-Ecosystem-Manager_JR78853 As an HBM Ecosystem Manager in the AI Solutions Group, you establish and maintain strong relationships with key ecosystem partners in the 2.5D High Bandwidth Memory (HBM) industry in Taiwan. You will be required to have a deep understanding of heterogeneous integration techniques which enable the manufacturing of advanced AI systems incorporating Micron’s best in class HBM. You will engage with leading OSAT companies such as TSMC, ASE/SPIL to identify business opportunities and provide robust on-site business and technical support. Your work will be essential to the AI Solutions Group Product Management Team to secure business wins, while also ensuring the relevant internal technical teams get involved. You will collaborate closely with Micron’s local packaging technology development team to help devise strategic engagements for future HBM products, ensuring Micron continues to be at the forefront of new AI hardware platforms. You will also work with Micron’s local Operations teams during New Product Introduction (NPI) phases, contributing to business and revenue wins through executional excellence. Key Responsibilities: • Manage multiple OSAT/heterogeneous integrator accounts, providing local support to enable the latest integration techniques affecting Micron’s HBM product portfolio. • Engage with key AI hardware related semiconductor companies in Taiwan to reinforce Micron’s position as a leading HBM supplier, including foundries, fabless ASIC, and IP vendors. • Work closely with the Advanced Packaging Technology Development (APTD) team to support defining product roadmaps and execution strategies aligned with integrating/packaging technology trends. • Provide Business Unit (BU) support and direction to local Operations teams during NPI phases of new HBM products, streamlining business enablement and execution. Key Qualifications: • Minimum 6 years of experience in semiconductor packaging • Experience in 2.5D System in Package (SIP) manufacturing industry • Experience in DRAM manufacturing preferred • Master’s degree in engineering (Chemical, Material, Mechanical or Electrical Engineering) • Minimum 4 years of experience in customer technical support/engagement roles • Experience in business role preferable – product management, product planning, technical marketing. • Fluent in Mandarin with good, clear communication skills in English • Independent thinking, with strong sense of responsibility and proactive approach to ensure high standard of work is delivered on time