Failure Analysis Engineer - Staff

Overview/Job Summery We are seeking a highly skilled FA engineer to perform device level failure analysis to support customer returns, yield excursions, product qualifications and new product development. The successful candidate will be responsible for ASIC and MEMS die level failure analysis as well as system level defect isolation to identify root cause of failure. The candidate has to be familiar with EFA/PFA and 8D report writing. This role shall well coordinate CQM, product engineer, foundry process team, SQE, quality team and designers to drive customer issue solving. He/She will be trained to construct customer issue dashboard and define dppm reduction strategy. Responsibilities: · Perform the Failure Analysis (FA) and background/data analysis for customer returns, yield excursions, product qualifications and new product development to find the root cause. · In-depth failure background analysis. Support customer engagement and drive resolution of customer quality issues. · Collaborate with cross-functional teams including CQM, product engineer, foundry process team, SQE, quality team and designers to understand sensor/module failure mechanisms and recommend corrective actions to improve product quality using advanced techniques. · Perform physical failure analysis toward the failure IC, including optical microscope inspection, IROM, SEM/EDX, 3D profiler, SEM cross-section, FIB, SAT, micro-probing and hotspot analysis (EMMI/InGaAs/OBIRCH) …etc.