YOUR ROLE 1. Design and conduct test to support Sales provide technical solution to semiconductor customers 2. Provide technical support for materials characterization, process application, and reliability testing 3. Troubleshoot and analyze technical issues related to materials or components 4. Collaborate with R&D, Product, and market teams to deliver customer solutions 5. Prepare and deliver technical presentations or reports in English and Mandarin 6. Conduct sample preparation, analysis operation (e.g. SEM/EDS, FTIR, TGA, etc.) and method development 7. Document testing workflows and ensure data traceability YOUR ROLE CAN OFFER YOU 1. Expert in semiconductor package & well experienced in die-attach process 2. Acknowledging various product technology in IC packaging field as well as Adv. Package area 3. Independence expansion space to develop technical solution with lab resource 4. Developing leadership during work with the team 5. Opportunities to be filed AE to communicate with customers YOUR SKILLS 1. Master’s degree in Materials Science, Chemistry, Chemical Engineering, or related field 2. 3-5 years of work experience in semiconductor, materials testing, component reliability, or related fields 3. Strong analytical mindset and hands-on experience in materials characterization techniques 4. Good communication skills in both English and Mandarin (written & spoken) 5. Proficiency in Microsoft Office (Word, Excel, PowerPoint) 6. Customer-oriented, proactive, and comfortable in fast-paced environments 7. Ability to work independently and manage multiple technical tasks ***
待遇面議
(經常性薪資達 4 萬元或以上)
未填寫
◆ 獎金 / 禮品類 1.年終獎金 2.生日禮金/禮品 ◆ 保險類 1.員工團保 2.眷屬團保 ◆ 制度類 1.介紹獎金 2.績效獎金 3.員工提案獎金 4.優惠退休金辦法 ◆ 請 / 優渥休假制度 1.特休/年假 2.性別中立全薪親子假 ◆ 其他 1.每年健康檢查 ◆ 補助類 1.旅遊補助 **以上福利項目台灣漢高並將依集團策略及營運現況調整**