Good ODM/OEM system design knowledge for server solution and industry design standards Electronic: 1. Review develops system requirements and create high quality, detailed product architecture specifications and check list. 2. Responsible and Coordinate for the product system level of electronic or mechanical or thermal or mechanical design engineering. 3. Review board level and system level design to identify any potential system issue and drive resolution. Perform case study or/and FA and provide issue resolution recommendation. 4. Technical support for urgent case by request. Thermal: 1. Support system PM to evaluate/review system design details, including power consumption's, air flow, solution characteristics, temperature sensors and related design validation of system thermals. 2. Familiar with thermal design process/analysis in component level and system level. Mechanical: 1. Reviews the system mechanical architecture 2D/3D design drawings (GD&T), identifying the critical dimensions, performing a tolerance stack analyses. 2. Works with component PMs (chassis, connectors, and cards) to develop subsystem and system-level performance specifications to meet customer’s requirements. 3. Performs finite element (FE) simulations and related testing from concept evaluations to design functional verifications (when needed). 4. Coordinates with Lab and other system validation teams to qualify the system with the final tooling chassis and related component designs at system integration phase of the system development 7. Before Beta release (FAI/Cpk). 5. Reviews any proposed mechanical engineering changes (ECs).
待遇面議
(經常性薪資達 4 萬元或以上)
Strong communication skills. Self-motivated individual and a great team player Electronic: 1. BSEE 5+ years of developing Intel/AMD server system architecture from concept to implementation. Prefer 10 years design experience. 2. Experience in system level design and architectures: electronics, thermal, mechanical, development and analysis, system reliability, and risk mitigation. 3. Knowledge and hands-on of PCB design, high-speed electrical design, and voltage regulator design. 4. Familiar with oscilloscope and other lab equipment. 5. Attention to detail and strong problem solving skill. Thermal: 1. Bachelor’s degree in Aerospace, Thermal or Mechanical Engineering discipline and Master's degree in engineering is a plus. 2. At least 4 years of experience in server/storage/blade ODM/OEM design and validation. 8+ years of experience is preferred. 3. Require server knowledge/experience of the system design process and thermal design/management, heat transfer material, cooling devices. 4. Strong organizational, problem solving, solid communication skills in both verbal and written. Mechanical: 1. MS in Mechanical Engineering or equivalent. 2. At least 3 years of mechanical design engineering experience of electro-mechanical components and systems. Experiences with computer mechanical architecture preferred. 3. Hands-on experience and working knowledge with computer aided design (CAD) software package (PTC or CREO preferred). 4. Proficient in Geometric Dimensioning and Tolerancing (GD&T), experiences in tolerance stackup analysis a plus. 5. Experiences in FE simulation and/or mechanical testing.
◆ 薪酬類 1.每年發放 2 次績效獎金 2.中秋、端午及生日禮券 ◆ 保險類 1.勞保 2.健保 3.員工免費團保 4.眷屬優惠自費保險 ◆ 休假制度 1.週休二日 2.優於勞基法的特休制度 ◆ 補助類 1.結婚禮金 2.生育禮金 3.住院、喪禮慰問金 4.子女獎學金 5.運動健身補助 ◆ 其他類 1.公司週年慶、年終尾牙 2.定期電影欣賞會、電影票發放 3.定期部門聚餐 4.社團活動補助 5.免費供應午餐(八德) 6.免費機車停車位(八德) 站上國際舞台,開創非凡職涯:至美國加州矽谷、荷蘭出差與培訓的機會,與世界頂尖研發人員切磋交流