1. Lead the design and development of memory layouts for complex ICs, incl.: High-density SRAM memories, Specialty memory blocks (e.g., ROM, CAM) 2. Define memory architecture and sub-block specifications 3. Develop and implement advanced layout techniques for low-power, high-speed memory design 4. Collaborate with design and verification teams to ensure seamless integration 5. Mentor Jr. engineers and provide technical guidance 6. Stay up-to-date on the latest memory design trends and technologies 7. Perform comprehensive physical verification using DRC, LVS, and other tools 8. Drive Design for Manufacturability (DFM) and Design for Yield (DFY) initiatives 9. Analyze layouts for potential power integrity and signal integrity issues 10. May involve scripting automation for layout tasks using languages like PERL, Shell, TCL, or Skill 11. Excellent English communication skills 12. Strong communication skills to coordinate with team members and management 13. Work w/ TSMC Canada & Taiwan Teams 14. Local hired by HCLTech Canada This role is for a seasoned* Memory Layout Engineer with 6-8 years of exp. to lead the design and development of high-performance Memory blocks for Integrated Circuits (ICs). You will be a technical expert responsible for creating innovative memory layouts that push the boundaries of performance, power efficiency, and area optimization. Onsite TSMC Design Center in Ottawa, Canada *Seasoned: means suitable candidate should be pretty strong in their skill & concerned knowledge because the panel interview is very stringent.
待遇面議
(經常性薪資達 4 萬元或以上)
A. Min. qualifications: 1. B.S. in Electrical Engineering, Computer Engineering, or a related field 2. 5-8 yrs of exp. in advanced Memory Layout design, with total 6+ yrs of working exp. 3. In-depth knowledge of Memory compiler architectures, sub-blocks, and functionalities 4. Proven expertise w/ Memory Layout tools like Cadence Virtuoso, Calibre, and Assura 5. Extensive exp. w/ Low-power, High-performance, and High-density memory design across various leading technology nodes (e.g. 3nm, 5nm, 7nm FinFET) 6. Solid understanding of Design for Manufacturability (DFM) and Design for Yield (DFY) principles 7. Strong leadership, communication, and teamwork skills 8. Ability to manage multiple projects and meet deadlines effectively B. Preferred qualifications: 9. Exp. w/ Emerging Memory technologies (e.g., MRAM, ReRAM) 10. Exp. w/ advanced place and route techniques for Memory Layouts 11. Exp. w/ Memory Verification Methodologies and Automation tools 12. Scripting proficiency for Layout Automation and Data Analysis Others: 1. Ability to communicate w/ cross-functional teams in English & Chinese fluently. English reading/speaking is a MUST. 2. Bilingual capability is required (Mandarin & English). 3. Must demonstrate initiative and ownership of assigned responsibilities 4. Ability to work collaboratively and openly with cross-functional Team Leaders, members and client 5. Soft Skills: Good listener, positive attitude, sense of humor, open minded, respect, patience, resolving issues, etc. 6. Exp. working in a collaborative environment and promoting a teamwork mentality 7. Patience to detail, Good analytical thinking and problem-solving skills 8. Ability to predict challenges and seek to proactively head-off obstacles 9. Can work independently (e.g. manage tasks to complete on time, etc.) 10. Can work under pressure 11. Can adapt to fast-paced environment 應徵需附上英文履歷 可以接受英文線上面試 年薪可談
提供 勞保 / 健保 / 退休金6%提撥 / 商業保險(員工本人配偶及子女) 年薪結構為 本薪12個月 + 1個月年終 + 考核獎金,絕對優於市場水平 提供 網路費補助 及 電話費補助,因疫情或工作需求需要在家工作 提供每年健檢計畫 提供遠優於勞基法之休假,15天年假,15天全薪病假