「PCB Layout 工程師【台元科技園區】」的相似工作

1.鋰電池BMS電路layout設計 2.確認電路PCB及FPC layout 3.開發新的軟性PCB及高速PCB的驅動板 4.相關layout文件處理 5.協助處理其他產品設計相關事宜 6.配合電子及機構工程師作業及主管交辦事項

1. 高速以及高頻訊號多層板(16層)的PCB layout。 2. 電子元件symbol與footprint檔建立，維護資料庫及完成相對應文件，設定layout判斷條件、走線規範、擺件、線路優化。 3. 與硬體設計、機構與熱流工程師討論合作完成佈局修改。 4. 產品相關文件，Gerber產出，EBOM，MBOM。 5. 協助有關PCB設計、生產工藝、PCBA與元件備料等各項工程問題。 6. 併板、Gerber產出，與PCB板廠溝通PCB製作細節。 7. Design Rule以及Layout Review規劃及檢查機制建立。 8. 完成主管交付任務。

Layout Design 協助專案佈線,文字面等後續處理事宜

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

1. 與客戶端進行技術/工程規格之討論與需求確認 2. 依客戶需求繪製電路圖 3. 依電路圖需求進行 PCB layout 4. 產出製作檔案給廠商，並討論工程問題 5. 協助專案產品除錯與功能驗證 6. 完成其他主管交辦事務 7. 需視案件時程彈性加班，確保專案進度與品質

在Gemini (APU) 晶片系列的設計中,做類比與數位IC佈局(Layout)和DRC, ERC, ANT, LVS之驗證, 該系列的晶片可提供高效率且廣泛的AI應用　　　　　

1.Layout Design 2.協助專案佈線,文字面等後續處理事宜 3.協助零件建立 4.完成工程師、主管交辦事項

1. PCB佈局、擺件、佈線 2. Design Rule & Allegro Constraint 設定 3. CAD/CAM檢查與Gerber輸出 4. 協助解決PCB設計、PCB製造及PCB組裝的各項工程問題

IC layout

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

1.依客戶需求設計PCB (Load board/BIB) 達成客戶所需交期 2.整合與改進Layout and PCB simulation 3.協助客戶解決PCB問題與技術支援 4.BOM表維護, PCB生產問題排除與追蹤 5.具良好團隊合作、溝通能力與學習力

1. Analog mixed signal IC layout 2. 熟悉IC Layout tool 3. 熟悉先進製程

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

1.電子信息工程，電子科學與技術，通信工程電子類相關專業。 2.本科及以上學歷。 3.熟悉電路圖原理分析，電子理論基礎强。 4.1-3年工作經驗，接受應屆生。 5.能接受國内外出差。

負責 3D-IC Interposer 與類比 IP 佈局設計 (Virtuoso / Allegro)，確保電性與實體規格，優化設計流程。 熟悉 Layout tools、Foundry PDK為佳。

1.各式文件管理 2.學習並執行相關SI專業 ◆◇誠摯邀請外向開朗、積極主動的您加入我們團隊，一同實現理想與抱負◆◇

1. 負責IC版圖的自動佈局佈線、優化和驗證。 2. 確保IC佈局符合Circuit Designer設計需求及產品、製程、電氣的規範。

1. 執行通訊產品Layout工作 2. 獨立完成PCB Placement, Constraints Manager, Routing, G/O 3. 能解決PCB設計,製造,組裝各項工程問題 4. 熟Allegro/Gerber等Layout相關軟體

1.飛針機機台操作 2.飛針機程式撰寫 3.元件焊接 4.產品維修