「技術工程類-Substrate Layout工程師(封裝佈局)」的相似工作

需有Substrate Layout 相關經驗。

- Job Description - Responsible for assisting in project documentation, layout planning, and follow-up tasks, supporting substrate layout design for advanced probe cards. - Responsibilities - • Organize project documents and design data • Plan and execute substrate layout drawings • Perform design checks (DRC, DFM) • Collaborate with manufacturing teams to meet design requirements and implement changes • Support CAM data verification and output before manufacturing - Qualifications - • No specific experience required; interest in PCB/substrate layout is a plus • Related layout experience preferred; training will be provided for new graduates • Familiarity with Cadence Allegro is a strong plus • Familiarity with Cam350 is a plus - Preferred Skills - • Understanding of PCB/substrate design workflow • Experience in high-speed signal or power routing • Background in packaging or probe card industry

1.鋰電池BMS電路layout設計 2.確認電路PCB及FPC layout 3.開發新的軟性PCB及高速PCB的驅動板 4.相關layout文件處理 5.協助處理其他產品設計相關事宜 6.配合電子及機構工程師作業及主管交辦事項

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1. Flip chip package substrate design. 2. Capable provide optimization design proposal. 3. Capable to co-work with substrate/material suppliers directly. 4. Design rule maintenance. 5. Work closely and Interface with various teams (product, PE group and supplier…etc) 6. A plus for Good command of written and oral in English.

1. Analog mixed signal IC layout 2. 熟悉IC Layout tool 3. 熟悉先進製程

【工作內容】 • 我們正在尋找具備先進製程經驗的 IC Layout 工程師，加入團隊後可以參與高階SoC /Analog IP 的實體實現，並負責以下工作： -Mixed-Mode FinFET Layout 設計與繪製，確保電路佈局在效能、面積與可靠性之間取得最佳平衡。 -進行 FinFET 製程相關的 DRC / LVS / ERC 驗證，確保設計符合法規與 Foundry 要求。 -熟悉 XRC & EM/IR 分析流程，進行可靠性評估，並針對潛在問題提出改善方案。 【職務條件】 • 必備條件：具備 FinFET 製程經驗，能獨立進行版圖設計與驗證。 -具備類比電路佈局經驗，了解電路特性與佈局考量，能與設計工程師密切合作。 -具備良好的溝通能力與團隊合作精神，能在專案時程內交付高品質成果。

IC layout

1.PCB Layout design, 須專精Allegro軟體 2.熟悉burn in board PCB設計 3.客戶技術溝通協調 4.產出PCB生產文件，建立並維護元器件的零件庫 4.視工作表現而定，額外提供每月點數獎金 5.表現優秀，培養二年後年薪可破百萬

【Customer Engineering Account Management】 (1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery (2)Offer industrial leader’s advanced package solutions and services through integration of package and process development 【Project management】 (1)Project phase in schedule arrangement and follow up (2)SWR arrangement ,schedule follow up, negotiation…etc. (3)PKD/PMD creation (PLM) (4)Reliability arrangement 【Team Work】 (1)To optimize resource allocation (2)Enhance teamwork in 360° including customer, supplier and our colleagues (3)Develop self and others 1. 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘； 2. 資深人員薪資另議。

1.SENSOR-LAYOUT、設計作業 2.產品開發及修改，進度管控、設計改善 3.與供應商技術溝通、時程管控、改善分析 4.其他主管交辦任務

【職務內容】 ˙需具備HV經驗 Level Shifter（含 HV Device）、Charge Pump、Source Driver、OpAmp / DAC、TCON（含 Digital Layout + Clock Tree） ˙需具備3-5年Driver相關經驗 ˙需熟悉繞線（Routing） ˙Block-Level設計經驗可 ˙能讀懂 Calibre DRC command file 語法佳 ˙具備28/22nm HV製程經驗佳 ˙無需英文能力，全台灣團隊

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

1. 負責IC佈局和佈線的設計和開發 2. 實現佈局和佈線的細節設計和調整 3. 與相關的團隊成員合作，確保佈局和佈線設計能夠達到高效率和性能 4. 配合其他工程師進行相關的測試、分析和報告 5. 解決相關佈局和佈線問題 6. 修改維護 Command file 7. 使用CADENCE VIRTUOSO或LAKER等工具進行IC佈局和佈線的驗證

1. 了解顧客委案需求及問題分析處理(進案作業) 2. 客戶委案異常處理 3. 協助專案工程開發 4. 年薪依個人表現而異，表現優異之工程師年薪可達85萬，表現優異之副工程師年薪可達75萬

加入專業 IC 團隊，專責成熟製程的 Analog / Mixed-Signal 晶片開發與版圖設計，實作涵蓋 28nm 節點、ESD 保護與高速 Tx/Rx 模組，適合具備實務經驗並渴望技術突破的版圖工程師。 【工作內容】 • 使用 Laker 或 Virtuoso 進行 Analog / Mixed-Signal 電路之版圖設計 • 使用 Calibre 進行 DRC / LVS 等驗證作業 • 負責 28nm 等低電壓製程節點之 Layout 設計與優化 • 具備 ESD 與 Tx/Rx 電路 Layout 經驗者尤佳 • 與設計團隊密切協作，確保電路性能、面積、可靠度與製程規範之平衡 【職務條件】 • 具備 2 年以上 IC Layout 實務經驗 • 熟悉 EDA 工具：Laker、Virtuoso、Calibre（含 DRC / LVS） • 熟悉 Analog Layout 基礎與高階電路（含 LV、28nm） • 曾參與 IP 整合、版圖組裝與驗證流程 者佳 • 具備主動積極、細心耐心、具抗壓與團隊合作精神，能依時交付任務成果

1.機構圖/電路圖剖析轉檔 2.依電氣/安規/製程/客戶規範進行零件擺放/銅箔線路規劃設計 3.PCB排版圖繪製 4.工程圖面轉置發行 4.PCB料號申請 5.PCB文件上傳系統

1. IP layout design 2. 具記憶體IC/IP佈局佈線實務經驗，SRAM尤佳 3. 熟悉layout軟體

1. Probe Card PCB Layout 2. 確認產品需求/設計 3. 協助客戶完成PCB設計 4. 廠內外溝通，完成主管交辦事項

1. Manage project and handle the NPI schedule to meet customer's requirement. 2. Discuss new product spec, and roadmap with customer and internal department directly. 3. Coordinate with internal department and drive the development schedule. 4. Regular meeting with customer and present project status. 5. Make new product release to mass production smoothly. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。