「技術工程類-研發工程師Package designer(記憶體封裝)」的相似工作

1. 封裝固晶(Die-Bond)製程作業。 2. 固晶(Die-Bond)相關設備保養維護、異常排除、效能改善、改機調機。 3. 封裝固晶(Die-Bond)製程改善與開發。 【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047

This position is responsible for resolving customer quality related issues and acting to resolve quality problems.This team will act as a key point of communication with customers on subjects as examples but not limited to customer complaints, customer requests. If have over 1 years quality related experience will be preferred. 【Key Responsibilities】 1.Customer claim and CAR disposition & follow-up. 2.Customer audit arrangement and finding follow-up. 3.Regular audit report preparation and meeting with customer. 4.Interface between PTI & customer on quality issue. 5.Strengthen customer relationship. 6.Satisfy customer on quality service. 【Problem Solving】 Recognizes and solves typical problems that can occur in own work area; evaluates and selects solutions from established options 【Interpersonal Skills】 Uses communication skills to exchange information; fluent English skill is perfect. TOEIC at least 600.

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

**Job Duties & Responsibilities** • Process flow design for CIS / HBM / FOPLP NPI products. • Coordinator for issue analysis and progress follow-up with internal cross-functional teams. • Regular meetings with customer and end customer to provide issue explanation and root cause analysis. • Serve as the interface between the PE team and customer for engineering-related discussions; work with customers and lead internal teams for all NPI phase-related activities such as setup reports, FACA, and PFMEA. • Lead new process development, machine surveys, and material evaluations in collaboration with internal cross-functional teams and vendors. **Candidate Requirements** • Passion for learning new processes across different fields. **Preferred Qualifications** • Fluent in English speaking (TOEIC 650+). • 2+ years of experience in customer interaction. • 2+ years of experience in project handling, such as CIP, cost reduction, or yield improvement. • Familiar with wafer-level assembly processes (CIS / HBM / FOPLP). * 熟悉半導體MEOL/BEOL各製程或具備跨部門溝通經驗尤佳。 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。 　 　 　 　

1.Communicate with customer/partner and subcontractor to define the package design requirements, or specifications. 2.Propose the package size, structure according to requirements and specifications from customer. 3.Design the package and optimize to meet product specifications, coworking with related layout, electrical and thermal engineering teams. 4.Prototyping document preparation 5.Link with suppliers and follow up the development trend.

1. Marketing analysis and customer relationship management. 2. Take business opportunity and promote at customer site. 3. Define business direction based on PTI strategy and cost structure. 4. Contract review and price negotiation. 5. Well communication between customer and internal team. 6. Achieve monthly and annual sales target.

1.CP/FT測試可行性分析 2.專案測試開發 3.量產產品維護

1. 具研讀Paper能力 2. 工程相關背景(電子/電機/機械/化學/化工/材料) 3. 開發新產品/新製程/新材料 4. 具製程能力/統計槪念與實驗設計者佳 5. 完成主管交辦事項

1. 新產品量產問題改善/條件優化 2. cost down / second source專案 3. 具製程能力/統計槪念 4. 執行上級交付任務

因應半導體產業成長，公司目前擴大招募各項職務專業人才！！！ 歡迎查看104所有職缺，請針對有興趣的職缺【主動應徵】讓主管看到您的履歷， 通過書面審核會主動與您聯絡邀約面試。 不管在生產製程、品質技術、自動化設備、職安環保...等 只要跟化學材料相關的，都可以找到發光發熱的舞台！ 對高階電子材料、生產製程有熱情的你，歡迎加入關東鑫林，一起為世界打造下一顆晶片的力量！ **各項職務上班時段、地點、薪資皆不相同，詳細請查看各項職務內容，或於面試時說明** **請針對有興趣的職缺【主動應徵】讓主管看到您的履歷，通過書面審核會主動與您聯絡邀約面試，勿直接投遞此職缺，謝謝您**

1.封裝製程良率提升 2.製程異常處理與分析 3.改善現有生產製程 4.新產品導入專案 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。 具封裝前段(切割研磨、DB、WB...)製程經驗者優先面試。 歡迎理工科系之應屆畢業生、兵役屆退者、 半導體相關產業，製程經驗一年以上人士加入。

1. 開發與維護長晶爐影像處理軟體 2. 設計與實作影像分析演算法（如：物件偵測、邊緣辨識、溫度分佈分析等） 3. 協助工廠導入 AI/ML 模型，進行製程優化與預測分析 4. 整合影像處理與 AI 模組至現有系統架構 5. 撰寫技術文件與測試報告 6. 與硬體、製程、設備團隊合作，進行系統整合與問題排除

1. To improve device yield &CIP in order to meet customer request and customer service. 2. Identify and solve process and device problems. 3. Support for customer visit and audit.

1、機構/機械設計 2、實驗規劃與測試 3、技術文件撰寫 4、ISO文件撰寫 5、應用材料及新技術評估

普利司通(Bridgestone)為提供永續行動力及進階解決方案的全球領導品牌，自1982年在台灣開始深耕，期許以「最高品質貢獻社會」，透過永續發展與創新持續企業經營，歡迎加入普利司通的大家庭並共同追逐您的夢想Be Bridgestone & Chase your dream 1. 輪胎製程現狀分析改善 2. 輪胎製品不良判定 3. 製程規格表製作發行及製程條件設定 4. 輪胎新規格試作 5. 相關會議報告製作 6. 其他主管交辦事項 ※歡迎尋求穩定工作，重視工作安全的您，一同加入台灣普利司通的行列，共同為公司及您的生活打拼。 ‧ 依勞動基準法，雇主不得僱用未滿十五歲之人從事工作。 According to labor standers, no employer shall employ any person under the age of fifteen. ‧ 依就業服務法，外國人須經雇主申請許可，始可在中華民國境內工作。 According to employment service standers, foreign worker may engage in work within the Republic of China should his/her employer have not yet obtained a permit via application therefore.

協助核心技術發展 執行新產品開發專案 進行新產品、新材料、製程參數設計 客戶需求可行性評估 樣品管理 提升產品品質 協助產品推廣

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ 1. NPI related 2.Technique support to customer 3.Process development with customer 4.Customer quality issue handling 5.Customer Audit handling

1. 新設備評估 2. 新藥水導入 3. 新製程開發

Bumping & WLCSP F/E 黃光&白光&AOI 1.研發專案執行及規劃 2.新材料及機台設備評估 3.客戶服務、技術支援 4.新產品導入量產驗證、製程改善 5.生產流程異常處理、分析、規範制定

輝虹科技尋求認真負責、自動自發、且對創造先進技術充滿熱情的機構工程師，在這職位上，您將建造自動檢測設備的原型機，並與跨領域的團隊一同合作，您將可在光學設計、機構設計、系統整合、自動化及量測技術等多樣化的主題中發揮長才。 主要技能： 1. 機械工程、材料科學、熱力學、流體動力學和機械振動相關知識 2. 設計與整合光學和真空系統之經驗 3. 機械系統的原型設計、測試和驗證方法的實作經驗 4. 精通 3D CAD 機械設計軟體的使用 5. 獨立分析與解決問題的能力 6. 良好的溝通技巧 7. 有光學定位經驗與真空技術者尤佳 職責： • 設計、開發和測試光學與真空系統中的機構元件（光學治具、高精度定位、真空腔體、自動化機械等等） • 機構材料和元件之評估與採用 • 與跨領域之團隊合作，達成計畫目標 • 撰寫和發布技術文件 • 協助解決製造與生產過程中的問題 輝虹科技的薪酬及獎勵包含股權激勵計畫，提供映思員工成為公司股東的機會，另外為鼓勵員工的傑出貢獻及創意思維，也會提供額外的獎勵，我們也非常重視創新、發明專利及智慧財產，你的薪資範圍將會取決於您的學經歷、工作技能及專業證照等。 Skyeuv is seeking a highly motivated and skilled Mechanical Engineer with enthusiasm for learning and creating pioneering technologies. The ideal candidate will have a strong background in mechanical design and analysis. In this role, you will build the prototype of automatic inspection products and have the opportunity to work with a cross-functional team. The position allows you to work on a wide spectrum of topics, including prototyping, system integration, automation and developing metrology. Key Qualifications: 1. Knowledge of mechanics, materials science, thermodynamics, fluid dynamics, and mechanical vibration. 2. Experience with optical and vacuum systems design and integration 3. Hand-on experience in prototyping, testing, and validation methods for mechanical systems 4. Proficient in 3D CAD software 5. Strong analytical and problem-solving capabilities 6. Excellent communication skills 7. Familiar with optical alignment techniques and vacuum technology is a plus Job Description: • Design, develop, and test mechanical components for optical and vacuum systems such as optical mount, precision alignment, vacuum chamber, vibration isolation, automation, etc. • Conduct research and analysis to determine the best materials and components for optical and vacuum systems • Collaborate with cross-functional teams to ensure successful project execution • Develop and maintain technical documentation • Support manufacturing and production processes by providing technical expertise and troubleshooting assistance Skyeuv 's total compensation package may include equity incentive plan which provides the opportunity for enst employee to become an enst shareholder. enst aslo offer additional rewards package to encourage enst employees for outstanding contributions and creative idea. Innovation, invention patent and intellectual property is highly valued. Your pay ranges will depend on your experience, skills, and qualifications .