1.來料wafer,封裝後Nand測試等相關卡控標準定義
2.verify Nand flash生產製程/製程關鍵參數定義及管控標準/信賴性測試項目及標準/出貨檢驗項目及標準/Data sheet.(Wafer/Assembly/Testing) 3.Wafer, assembly, testing process audit
4.Regular quality meeting review with supplier & sub-tier supplier 5.Cross function team discussion for Nand quality improvement with internal/external team.
1.Develop & build SSD validation flow & test plan.
2. Discuss directly with customers for qualification process & test plan
3. Reproduce customer issues, triage failures, & verify fixes with the project team
4. Working closely with the project team to develop test scripts to fulfill customers' requirement
5. Design & optimized the manufacturing framework
6. Manage internal qualification schedule & reports
7.Go on-site for JQ testing
Key Responsibilities:
- Responsible for wafer foundry and assembly/testing subcon quality management, to manage all events
which subjected to quality issue.
- External abnormal reporting handling. Drive subcon on problem solving and failure analysis to determine
the root cause of quality incident and bring out CAPA to solve the issue.
- Work with subcon and cross function team for MRB case for lot disposition.
- Collaborate with subcon and CQE and cross function team to follow and track the 8D report
for customer claim/request.
- Experienced in handling PCN project for change management as well as CRB and safe launch/ramping up.
- Surveyed, managed, evaluated and audited sub-con regularly.
- Regularly review subcon quality agenda and performance, drive for continue improvement.
- On-site check/audit subcon process/product control and lead on subcon quality improvement.
- Liaised between internal team and subcons for quality related subject.