「PCB Layout Engineer」的相似工作

1.產品高頻特性測試 2.產品高頻FAE 及FA特性分析 3.測試設備開發及PCB設計製作/驗收 4.專案開發人員

1. 建立與審查PCB Footprint。 2. OrCAD Capture CIS管理。 3. 設置Allegro Constraint 並確認Layout正確性。 *歡迎電子科系，無經驗者或應屆畢業生投遞*

【工作內容】 1.繪製 Schematic。 2.繪製PWB Layout。 3.核對 PWB 圖面。 4.申請與製作PWB & Schematic 相關文件。 5.維護CAD DB 系統。 6.建立Library 。 【工作技能】 1. 熟悉使用Layout軟體者佳(如：P CAD，Protel，Altium designer)。 2. 具電源產品Layout經驗者尤佳。

1. 工作態度佳、主動學習、積極進取、注重團隊合作 2. PCB擺件、Layout佈局 (HW R&D協助) 3. PCB零件庫之管理 4. 熟悉Allegro, OrCad軟體 5. 10000 Pin以上佈線，以及HDI經驗尤佳 6. 具工業電腦/FPGA佈線經驗尤佳 7. 設計領域 : RF Signal, Digital Signal above 10Gbps, High Power (HW R&D協助)

1. 高速以及高頻訊號多層板(16層)的PCB layout。 2. 電子元件symbol與footprint檔建立，維護資料庫及完成相對應文件，設定layout判斷條件、走線規範、擺件、線路優化。 3. 與硬體設計、機構與熱流工程師討論合作完成佈局修改。 4. 產品相關文件，Gerber產出，EBOM，MBOM。 5. 協助有關PCB設計、生產工藝、PCBA與元件備料等各項工程問題。 6. 併板、Gerber產出，與PCB板廠溝通PCB製作細節。 7. Design Rule以及Layout Review規劃及檢查機制建立。 8. 完成主管交付任務。

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

負責 3D-IC Interposer 與類比 IP 佈局設計 (Virtuoso / Allegro)，確保電性與實體規格，優化設計流程。 熟悉 Layout tools、Foundry PDK為佳。

【工作內容】 1.嵌入式主機板及週邊轉板的零件佈局及走線規劃 2.優化訊號品質的佈線觀念 3.SET Constrain 4.檢查底片(gerber)及獨立出圖(gerber out) 5.零件建立與維護檢查(零件庫建立) 6.PCB板廠EQ回覆 【必要條件】 1.電機、電子、資工、資電或相關科系大專以上學歷。 2.具備1年以上PCB Layout經驗。 3.熟悉任一PCB設計軟體工具（如Allegro, OrCAD, Altium Designer, PADS等）。 4.能閱讀與理解電路圖及原理圖（Schematic）。 5.具備高速訊號與訊號完整性設計概念。 6.細心負責，具備良好的問題分析與解決能力。

1.依照電子工程師及專案需求，進行電路板的Placement, Routing, Gerber out 2.PCB零件建立與資料庫維護 3.Gerber file 製作、發行及維護 4. 負責與 PCB 板廠溝通PC板製程等相關工程詢問 6. 負責與外包 Layout house對接跟進 PCB Layout 專案工作

1. 執行通訊產品Layout工作 2. 獨立完成PCB Placement, Constraints Manager, Routing, G/O 3. 能解決PCB設計,製造,組裝各項工程問題 4. 熟Allegro/Gerber等Layout相關軟體

1.PCB Layout design, 須專精Allegro軟體 2.熟悉burn in board PCB設計 3.客戶技術溝通協調 4.產出PCB生產文件，建立並維護元器件的零件庫 4.視工作表現而定，額外提供每月點數獎金 5.表現優秀，培養二年後年薪可破百萬

1.Dsn netsin and Dxfin brd. 2.PCB Component All Placement in作業. 3.完成Net Routing &Drc清除 and tune length作業. 4.Brd Gerber out and Check等案子實作. 5.跨部門溝通協調

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

Summary : you will create and refine PCB Layout designs for a variety of products and work closely with engineers and customers to finalize our product specifications. To be successful in this position you should have hands-on experience using CAD software and be detail-oriented and a team player. Responsibilities : •Complete development of CAD layout from footprint definition, detailed component placement and constraints management. •Set up constraints for each PCB layout. •Be responsible for the design releases required generation of artwork files, ODB++, FAB drawings, ICT report, and electronic PCB documentation. •Delivery Gerber file to PCB fabrication and assembly house and plan the lead time. •To resolve DFM / DFM issues. Qualification : •10+ years in PCB layout design and direct working experience using Cadence OrCAD schematics Capture and Allegro software. •Familiar with PCB design SW tools (Allegro, DraftSight, CAM350…), Altium is plus. Detailed understanding of multilayer PCB construction. •Experience with advanced PCB manufacturing techniques such as blind vias and microvias. •Power Electronics/Power management experience is desired. •Familiar with PCB fabrication and assembly process are desirable. •Bachelor/Master in EE, computer science, or relative majors, or equivalent experience. •Possess basic English communication skills.

IC layout

1.鋰電池BMS電路layout設計 2.確認電路PCB及FPC layout 3.開發新的軟性PCB及高速PCB的驅動板 4.相關layout文件處理 5.協助處理其他產品設計相關事宜 6.配合電子及機構工程師作業及主管交辦事項

1. 與客戶端進行技術/工程規格之討論與需求確認 2. 依客戶需求繪製電路圖 3. 依電路圖需求進行 PCB layout 4. 產出製作檔案給廠商，並討論工程問題 5. 協助專案產品除錯與功能驗證 6. 完成其他主管交辦事務 7. 需視案件時程彈性加班，確保專案進度與品質

1.To develop high efficiency, high power density power supply 2.To develop high efficiency, high power density DC to DC converter 3.To develop power shelf and test 4.To do design review for new project developing stage 5.To do power supply performance and quality improve for existent project 6.To check the 2nd source data/test report and follow up the process of 2nd source implement 7.To do power supply system and RMA issue analysis and improvement

(1)依據電路原理圖進行 PCB Layout 設計，熟悉雙層/多層板設計與高速佈線原則。 (2)負責 PCB 打樣、SMT/DIP 製程發包，含製作 Gerber、BOM、座標檔與追蹤交期。 (3)撰寫並整理產品測試報告、問題分析紀錄與製作建議。 (4)協助技術資料彙整與維護，如操作手冊、產品說明、設計圖面等。 (5)電池產業相關經驗者佳, (6)電子產業研發設計經驗3~10年以上者佳 (7)主管交辦事項 (8)具電機、電子等相關系所畢業

1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro 2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison. 3. Mechanical drawing for manufacturing process with AutoCAD. 4. Customers TV/DUT design integration and collaboration. 5. Impedance simulation and measurement for transmission line.