「PCB Layout Engineer」的相似工作

歡迎電源研發的專才與我們共同開創綠能相關量測電源！ 您將參與研發、維護交流及直流電源的量測，需要靈活的思緒吸收電路、法規及邏輯運算等知識，並應用於量測設備中，共同開創新一代的產品。歡迎具備熱忱且不畏挑戰的您！ 1. 電源產品的開發、設計及驗證(PFC/半橋及全橋/Flyback)。 2. 製作產品BOM表及技術相關文件。 3. 執行電源產品測試驗證作業，提出問題分析及改善方案。 4. 具PCB Layout經驗，與Layout團隊合作達成產品設計目標。 5. 進行電子元件選用及測試評估等作業。 6. 處理客戶問題分析，提供有效之技術支援及解決方案。 7. 完成主管交辦事項。

1. 工作態度佳、主動學習、積極進取、注重團隊合作 2. PCB擺件、Layout佈局 (HW R&D協助) 3. PCB零件庫之管理 4. 熟悉Allegro, OrCad軟體 5. 10000 Pin以上佈線，以及HDI經驗尤佳 6. 具工業電腦/FPGA佈線經驗尤佳 7. 設計領域 : RF Signal, Digital Signal above 10Gbps, High Power (HW R&D協助)

1.依照電子工程師及專案需求，進行電路板的Placement, Routing, Gerber out 2.PCB零件建立與資料庫維護 3.Gerber file 製作、發行及維護 4. 負責與 PCB 板廠溝通PC板製程等相關工程詢問 6. 負責與外包 Layout house對接跟進 PCB Layout 專案工作

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

1. 高速以及高頻訊號多層板(16層)的PCB layout。 2. 電子元件symbol與footprint檔建立，維護資料庫及完成相對應文件，設定layout判斷條件、走線規範、擺件、線路優化。 3. 與硬體設計、機構與熱流工程師討論合作完成佈局修改。 4. 產品相關文件，Gerber產出，EBOM，MBOM。 5. 協助有關PCB設計、生產工藝、PCBA與元件備料等各項工程問題。 6. 併板、Gerber產出，與PCB板廠溝通PCB製作細節。 7. Design Rule以及Layout Review規劃及檢查機制建立。 8. 完成主管交付任務。

1. 執行通訊產品Layout工作 2. 獨立完成PCB Placement, Constraints Manager, Routing, G/O 3. 能解決PCB設計,製造,組裝各項工程問題 4. 熟Allegro/Gerber等Layout相關軟體

1.Dsn netsin and Dxfin brd. 2.PCB Component All Placement in作業. 3.完成Net Routing &Drc清除 and tune length作業. 4.Brd Gerber out and Check等案子實作. 5.跨部門溝通協調

負責 3D-IC Interposer 與類比 IP 佈局設計 (Virtuoso / Allegro)，確保電性與實體規格，優化設計流程。 熟悉 Layout tools、Foundry PDK為佳。

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

Layout Design 協助專案佈線,文字面等後續處理事宜

Summary : you will create and refine PCB Layout designs for a variety of products and work closely with engineers and customers to finalize our product specifications. To be successful in this position you should have hands-on experience using CAD software and be detail-oriented and a team player. Responsibilities : •Complete development of CAD layout from footprint definition, detailed component placement and constraints management. •Set up constraints for each PCB layout. •Be responsible for the design releases required generation of artwork files, ODB++, FAB drawings, ICT report, and electronic PCB documentation. •Delivery Gerber file to PCB fabrication and assembly house and plan the lead time. •To resolve DFM / DFM issues. Qualification : •10+ years in PCB layout design and direct working experience using Cadence OrCAD schematics Capture and Allegro software. •Familiar with PCB design SW tools (Allegro, DraftSight, CAM350…), Altium is plus. Detailed understanding of multilayer PCB construction. •Experience with advanced PCB manufacturing techniques such as blind vias and microvias. •Power Electronics/Power management experience is desired. •Familiar with PCB fabrication and assembly process are desirable. •Bachelor/Master in EE, computer science, or relative majors, or equivalent experience. •Possess basic English communication skills.

IC layout

1.負責電子電路的設計與PCB繪圖。 2.設計、繪製並測試 功能電路模組。 3.制定並執行電路測試計劃、進行信號分析和故障排除。 4.與韌體工程師合作，進行電路板的功能整合和測試。 5.撰寫技術規格、測試報告等技術文檔。

1. 建立與審查PCB Footprint。 2. OrCAD Capture CIS管理。 3. 設置Allegro Constraint 並確認Layout正確性。 *歡迎電子科系，無經驗者或應屆畢業生投遞*

1.專案管理與排程規劃 (1)進行專案排程並帶領 Layout 團隊依時程完成各項專案板件 (2)與 RD、ME、EE 溝通，統整 layout 需求 (3)制定 Layout 進度表與人力分配 (4)協調跨部門專案排程 2.團隊營運管理及提升 (1)Design Rule 規劃及檢查機制建立 (2)Layout Quality 改善 (3)持續提升PCB Layout團隊繪製效率(有自動化流程規劃經驗、Skill Code撰寫能力者佳) (4)Layout Review (5)設計流程優化 (6)維護設計資料庫準確及設計共用化

You will perform Signal Integrity analysis, collaborating with different engineering teams to balance system/product constraints with high speed signals. 【Job Description】 • Perform pre-layout and post-layout simulation flow. • Create simulation models and develop simulation methodology for SI/PI design. • Stackup review and layer assignment for High speed and PDN • Use simulation and lab data to support design troubleshooting and propose corrective actions, drive failure analysis, root cause efforts, and design of experiments to resolve problems. • Analyze package/PCB PDNs and make design trade-off and negotiate power budgets. • Explore various design elements including different modules, memories, low/high speed buses, cables, components, their physics of operation, and impacts on system performance. • Provide system SI design guidance and perform post-layout review and optimization. • Work closely with EE design team and PCB layout team to optimize SI design based on the simulation data. • Generate simulation report based on the data with clear SI recommendation. 【Minimum Qualifications】 • Must have an MS or PhD in Electrical Engineering or Electrical and Computer Engineering • Proved experiences on board level signal and power integrity. • Board-level system architecture, I/O structures & topologies • Printed Circuit Board (PCB) design and layout process and methodology • Experience with signal integrity modeling tools, including 3D EM modeling (Ansys HFSS) and simulation (Agilent ADS or similar) software • Experience with signal and power integrity analysis tools (ex: HSPICE, Sigrity tools, etc) • Lab hands on experiences on TDR, VNA, BERTscope, digital scopes

1. 與客戶端進行技術/工程規格之討論與需求確認 2. 依客戶需求繪製電路圖 3. 依電路圖需求進行 PCB layout 4. 產出製作檔案給廠商，並討論工程問題 5. 協助專案產品除錯與功能驗證 6. 完成其他主管交辦事務 7. 需視案件時程彈性加班，確保專案進度與品質

(1)依據電路原理圖進行 PCB Layout 設計，熟悉雙層/多層板設計與高速佈線原則。 (2)負責 PCB 打樣、SMT/DIP 製程發包，含製作 Gerber、BOM、座標檔與追蹤交期。 (3)撰寫並整理產品測試報告、問題分析紀錄與製作建議。 (4)協助技術資料彙整與維護，如操作手冊、產品說明、設計圖面等。 (5)電池產業相關經驗者佳, (6)電子產業研發設計經驗3~10年以上者佳 (7)主管交辦事項 (8)具電機、電子等相關系所畢業

1.鋰電池BMS電路layout設計 2.確認電路PCB及FPC layout 3.開發新的軟性PCB及高速PCB的驅動板 4.相關layout文件處理 5.協助處理其他產品設計相關事宜 6.配合電子及機構工程師作業及主管交辦事項

1. 依照產品需求與提案者的設計，完成產品的硬體設計（如：器件選型、原理圖、PCB佈線圖、BOM表）。 2. 進行PCB樣品之跟催與測試檢驗。 3. 負責PCB零件庫之管理。 4. 監督、評核外包PCB板廠的品質。 5. 配合處理零件承認之相關事宜。 6. 協助客戶製作穩定的量產板，使客戶快速導入公司產品。 7. 配合軟體開發團隊完成產品的性能測試和相關認證事宜。

1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro 2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison. 3. Mechanical drawing for manufacturing process with AutoCAD. 4. Customers TV/DUT design integration and collaboration. 5. Impedance simulation and measurement for transmission line.