【部門說明】
本部門在新產品開發階段負責製程設計與驗證(Process Design & Validation), 透過DFM評估以及跨部門討論來改善產品設計, 規劃生產流程並導入大量生產。
在這裡工作可以學習到:
- 縱向開發與研究先進製程技術及橫向跨部門溝通協調,會應用到設備整合的知識、產線規劃與數據分析的技巧。
- 了解SMT與機構組裝未來趨勢,研究微型化與先進製程應用。
- 運用自身工程經驗,配合DFM、PFMEA等方法,評估產品的可製造性與潛在風險,並研究新的製程、材料與設備應用。
- 垂直整合完整的工廠流程,熟悉新產品從研發到量產的所有工作,深度了解設計端與製造端的連結。
- 該職位是多面向整合的要角,需統整產品開發時的問題,透過跨部門溝通協調與整合能力,解決生產線上的品質、製程、材料相關問題。
- 研發與製造團隊間的橋樑,並與國外工程師共同合作,拓展國際視野 。
【工作內容】
- New product design review for manufacturing
- Introduction of new product prototype/pilot run, verification and mass production
-Evaluation, development and introduction of new materials, processes and advanced production technologies.
-Abnormal quality and failure analysis and improvement. (PFMEA)
-To coordinate cross function team and do risk assessment for making (consolidating) the decision of production/manufacturing
-To communicate production status, issues with cross function team and lead / drive cross function team on issue solving
-To handle the regular PID (Product In Development) meetings and coordinate follow-ups
1. Plan and configure energy storage systems for various application scenarios, including: A. High-voltage battery packs and related components B. PCS, DC/DC converters, and high-voltage distribution equipment C. High-voltage safety and protection devices, such as contactors, fuses, and circuit breakers D. Thermal management solutions for optimal system performance.
2. Select and validate key components (e.g., PCS, DC/DC converters, switchgear, protection devices, and cable specifications) based on project requirements and grid codes.
3. Create and review wiring diagrams and single-line diagrams to ensure compliance with power system standards and safety regulations.
4. Collaborate with hardware and software teams to ensure compatibility and communication between EMS, BMS, PCS, and DCDC using protocols such as Modbus, CAN, and Ethernet.
5. Ensure compliance with regulatory standards for power grid integration, including grid codes and EMI/EMC regulations.
6. Provide on-site technical support and troubleshooting, including system commissioning, grid-connection testing, and functional verification.
7. Prepare technical documentation, including wiring diagrams, planning reports, and installation manuals, and assist with project acceptance testing.
- Camera module design
- ARM based SoC system design using nVidia, Ambarella, NXP, QUALCOMM platform.
- Edge AI camera design integrated with 2D/3D camera, Wifi, PoE, Display and battery.
- 硬體研發及測試技術:
1. 硬體線路設計驗證及除錯
2. 高速數位訊號量測及分析 (MIPI-CSI or DSI, Wi-Fi or BLE 4.0)
3. PCB Layout檢查及驗證
4. BOM表建立與檢察
5. 其他主管交辦事項
工作地點: 桃園市楊梅區中山北路一段199巷21號3F 或 桃園區幸福路202號8樓