「Server/Notebook Hardware Application Engineer - Taipei」的相似工作

NVIDIA is seeking an outstanding Lead Design Engineer to join our team. In this role, you will collaborate with other key design teams to develop NVIDIA’s next-generation products including GeForce, Virtualization, Datacenter, and Automotive products. We have crafted a team of exceptional people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of AI computing. Are you passionate about technology enabling growth in AI markets and want to change the world? Then apply now to join NVIDIA! What you will be doing: -Design responsibility for the creation of new products designed around our GPUs, DPUs, and CPUs to cover Graphics, Self-driving platforms, and Data centers. -The LDE is responsible for driving every aspect of design execution, initial testing, bringing, and managing the documentation required to release the product to manufacturing and partners. It also serves as the primary interface to the Silicon/Thermal/Mechanical/SI/EMC engineers. -The scope of the LDE role has been carefully tailored to allow these individuals to consistently deliver world-class product quality on a challenging schedule while applying great attention to detail and quality of execution. -Research the new feature/circuits/architecture and involve the establishment/discussion of industry standards, then implement them in the next-generation product/platform development. What we need to see: -BS/MSEE and 3+ years of board/System design experience -Knowledgeable in high-speed signal design rules and power design methodologies -Proficiency in digital/analog circuit simulation and fault diagnosis. -Proven ability to deliver complex projects from specification through to production. -Your work displays your passion for circuit development and strong problem-solving skills. -Strong communication and Critical thinking are required. -Deep system knowledge of at least 2 areas: Switch tray /Computer tray/Datacenter architecture development or PC/Graphics/Automotive product development. Ways to stand out from the crowd: Experience in high-speed interconnection technology in switch tray development. Proficient in IB/Ethernet switching chip system design and bring-up. Successful Candidate will possess the following traits: Can-do attitude; Critical thinking; Leadership; Ability to learn complex concepts in a fast-paced environment; Strong desire for creativity; Strategic thinking and good decision-making skills; Good interpersonal skills. NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most brilliant and talented people on the planet working for us. We welcome candidates from all backgrounds and are committed to building a diverse and inclusive team. If you are creative and autonomous, we want to hear from you!

We are looking for a senior engineer to be part of the mixed-signal design team building next generation NVLINK. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. You will be responsible for the development and implementation of high speed interfaces, including TX/RX/Clocking/PLL. You will have hands on experience taking innovative integrated circuit designs at data rates of 50Gbps and higher from concept through silicon characterization. What you will be dong: - Define circuit requirements and complete design from schematic, layout, and verification to characterization. - Conduct schematic design of deep-submicron CMOS technologies using Spectre, Hspice or like. - Take responsibility for the architecture, transistor design and verification using industry standard EDA tools such as Cadence virtuoso. - Optimize circuit to meet the specifications for system performance. - Work with layout engineers by providing detailed floorplan and guidance for matching and high-speed routings. - Provide support for post-silicon bring-up and debugging. What we need to see: - Master of Science or foreign equivalent degree in Electrical Engineering, Computer Engineering or related field with strong analog design background. - Minimum 2 years analog design experience in industry - CMOS Analog / Mixed Signal Circuit Design Experience in deep sub-micron process (especially in FINFET) - Experience with design and verification tools (Cadence's IC design environment, analog circuit simulation tools like Spectre, HSpice, Finesim, XA) - Experience in crafting test bench environments for component and top level circuit verification - Behavioral modeling of analog and digital circuits - Strong debugging and analytical skills - Analog simulation for noise analysis, loop stability analysis, ac/dc/tran analysis, monte-carlo, etc. - Strong communication skills and ability & desire to work as a great teammate are huge plus. - All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.

負責x86 系統主機板的硬體研發設計與驗證，確保產品符合性能和可靠性，協助解決設計與生產中遇到的問題。 主要負責x86系統主機板的 1‧線路設計 2.layout review 3. HW issue debug 4. 主機板 BOM

歡迎2026年畢業並正在找尋研發替代役的同學申請! Direction 1: System Design Power Validation Engineer Direction 2: PCB Layout Engineer Direction 3: System Application Engineer What you'll be doing: • Collaborate with system design, hardware, and power engineering teams to participate in end-to-end design, validation, and optimization of hardware products (such as GPUs, AI accelerators, server platforms, etc.) • Responsible for circuit schematic design and PCB layout using EDA tools (such as Altium, Cadence, Mentor Graphics) for multilayer high-speed board design and optimization • Perform PCB design reviews, assist in resolving signal integrity, power integrity, EMI/EMC issues to improve design quality and manufacturability • Participate in board bring-up, debugging, power testing, and performance validation of hardware prototypes, helping to ensure optimal power efficiency under varying operating conditions • Write and maintain design, validation, and test documentation, including but not limited to design specifications, validation reports, and test plans • Work closely with cross-functional teams to continuously improve design processes and enhance product innovation and competitiveness What we need to see: • Hold a Master of Science/Ph.D in Electrical Engineering or related field • Familiar with circuit schematic design and PCB layout processes, and basic proficiency with EDA tools (such as Altium, Cadence Allegro/OrCAD, Mentor PADS, etc.) • Strong interest in power management, DC-DC converters, signal integrity, and high-speed digital design is a plus • Good debugging, analysis, and problem-solving skills; able to work independently or within a team to resolve design and validation challenges • Good command of English for reading technical documentation and communication • Proactive, eager to learn, and passionate about the latest electronics and AI hardware technologies 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

1.需具備10年以上半導體封裝或電子元器件封裝領域從業經歷，熟悉封裝全流程技術細節，包括但不限於引線鍵合、倒裝焊、晶圓級封裝、系統級封裝（SiP）、功率器件封裝等主流工藝，瞭解不同封裝形式的技術特點與應用場景，全新產品開發（製圖、框架設計、耗材新開發、全新封裝設備評估、無到有） 2.需擁有 10年以上研發團隊管理經驗，曾帶領 20人以上 RD 團隊開展工作，具備團隊組建、人才梯隊建設能力，能根據專案需求合理分配人力，制定清晰的團隊發展規劃，培養核心技術骨幹。 3.熟悉研發專案管理方法論，能主導從專案立項、需求拆解、方案評審到測試驗證、量產交付的全流程推進，具備跨部門協作能力（如與生產、採購、品質部門對接），確保研發目標按時達成。

Has lead experience for X86 or GPU system. 1. 獨立(或領導一個團隊)負責伺服器(Server)產品之電子電路設計與開發 2. 能進行新技術/概念/晶片世代的研究並透過新案子實踐並提供符合(或超越)市場需要之產品設計 3. 審查設計及驗證之相關文件(Schematic/Layout/Validation Repot/Issue-analysis Report/Product specification…etc.) 4. 產品除錯及問題排除 5. 在不影響產品品質的前提下, 有效率執行設計研發流程; 並將價格(cost)和品質(quality)兩者都放進設計考慮中. 6. 能同時執行多個專案目標並成功完成 7. 能推動跨組織討論,有效率解決技術問題,並主持與客人之技術討論 8. 協助引領團隊並協助其他成員解決問題

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Role Summary We are seeking a highly motivated hardware engineer to join our team developing enterprise-grade network and storage products, including WiFi routers, Switches, Storage, and Server systems. This role will be responsible for hardware architecture design, schematic development, system integration, validation, and cross-functional collaboration throughout the product lifecycle. The candidates will have a strong background in digital circuit design, system-level thinking, and experience with high-speed interfaces such as DDR, Ethernet, PCIe, and so on. You will collaborate closely with layout, mechanical, RF, DQA, firmware, and manufacturing teams to deliver robust and scalable hardware solutions. Also, one must be very aggressive in providing suggestions and comments at the design stages and thinking widely, and making decisions for designs. Responsibilities - Lead or contribute to hardware architecture planning, including CPU/SoC platform selection, Ethernet switch/PHY ICs, Interface solutions, and high-speed interfaces (PCIe, Ethernet SerDes, USB, SATA). - Design and review schematics, select components, and manage and optimize BOM for cost, quality, and manufacturability. - Collaborate with layout engineers to optimize PCB stack-up, impedance control, signa,l and power integrity. - Work with RF, DQA, and SI teams to validate functionality, debug issues, and ensure product performance and reliability. - Define and execute hardware validation test plans, document results, and assist in root cause analysis. - Experience with EMC/ESD design and debugging techniques. - Evaluate and recommend updates for DFC (Design for Cost), DFM (Design for Manufacturing), and DFA (Design for Assembly). - Tear down competitor products to assess system architecture and solution. - Provide regular updates on project status and coordinate with cross-functional teams to align milestones and deliverables. Requirements - MS degree in Electrical Engineering or a related field. - Solid understanding of system-level hardware architecture for Networking, Storage, Server products, and RF fundamentals. - Hands-on experience in digital circuit design, high-speed interface design (PCIe, Ethernet SerDes, USB, SATA), and power management (LDO, DC-DC, PMIC). - Familiar with schematic and PCB design tools such as OrCAD, Allegro, or PADS. - Proficient with lab equipment such as oscilloscopes, logic analyzers, network analyzers, and power supplies. - Strong communication and teamwork skills, capable of working in a fast-paced, cross-functional environment. Preferred Qualifications - Experience in enterprise Switch/AP Router, Storage, or Server system hardware development. - Highly organized in managing hardware platforms and proactive in developing innovative product concepts. - Strong self-motivation with a proven ability to drive complex technical issues to resolution. Benefits - An international work environment with opportunities to collaborate closely with global development teams. - Excellent working conditions in a supportive and innovative atmosphere. - Competitive compensation package, including attractive salary, perks, and benefits. - Comprehensive group and health insurance coverage. - Complimentary drinks and snacks are available in the office.

1. 硬體電路設計與開發 • 根據專案需求進行系統架構規劃與電路設計（數位、類比、高速訊號） • 繪製原理圖（Schematic）與零件選型 • 與 PCB Layout 工程師合作進行電路板設計與佈線優化 • 評估並引入新技術與元件（CPU、GPU、DDR、Type-C、PD 等） 2. 功能實現與原型驗證 • 製作與驗證原型機（Prototype / EVT） • 分析與解決電路功能異常、訊號完整性（SI）及電源完整性（PI）問題 • 測試高速介面（USB, PCIe, HDMI, DP, Thunderbolt）與相容性驗證 • 優化功耗與散熱設計 3. 測試與驗證 • 制定並執行硬體測試計畫（功能測試、效能測試、穩定性測試） • 協助進行安規（EMI/EMC）、安規認證（UL、CE、FCC 等） • 進行系統相容性測試（各型周邊裝置、作業系統） • 與測試團隊合作分析並修正問題 4. 跨部門專案協作 • 與機構工程師（ME）協調 PCB 尺寸、元件擺放與散熱方案 • 與軟體工程師（SW）共同除錯（Debug）與韌體開發支援 • 與專案經理（PM）對齊時程與需求 • 與供應商（ODM/OEM/零件廠）討論設計、良率與成本 5. 量產支援與問題解決 • 支援試產（PVT）與量產（MP）階段的硬體異常分析 • 協助改善製造良率與穩定性 • 處理現場生產問題（SMT、組裝、測試工站） 6. 文件與版本管理 • 編寫與維護設計文件（原理圖、BOM、設計規範） • 設計變更（ECO/ECN）與版本控制 • 測試報告與問題追蹤（Issue Tracking）

請提供[英文履歷] [此職缺] 為Sensor 驗證團隊成員之一，負責執行sensor 性能與功能測試、資料分析與測試自動化腳本撰寫，並針對測試過程中發現的硬體與軟體問題進行排查，並與設計、軟體與製造等跨部門進行問題溝通與解決 ，確保產品品質達成既定標準。 [工作內容] - 依測試計畫執行sensor 性能與功能驗證。 - 使用與撰寫 Python 腳本進行測試自動化與資料擷取、分析。 - 分析sensor 輸出資料，彙整測試結果並協助問題定位。 - 排查測試相關之硬體 / 軟體 / 測試治具與資料收集問題。 - 閱讀線路圖與 PCB Layout 以識別量測/驗證重點與量測點。 - 使用實驗室儀器（電源供應器、示波器、數位萬用電錶、邏輯分析儀、DC Load 等）進行量測與評估。 - 與設計、軟體、製造等跨部門合作，提供測試觀察與建議。 [所需專業與技術] - 3年以上硬體設計或電子產品測試經驗。 - (必要條件) 熟悉 Python，用於測試自動化腳本撰寫 / 修改與資料分析。 - (必要條件) 具線路圖與量測點判讀經驗。 - 具硬體與軟體整合問題之排查與分析能力。 - 良好問題解決能力與跨部門(英語系國家)溝通協作能力。 - 英文聽/說/讀/寫 能力: 中上 用於日常作業。 [優先考慮] - 具sensor 驗證與測試實務經驗。 - 具備消費性產品開發或測試的經驗，如產品設計、系統驗證及製造。

具備 1~5年 X86或GPU硬體研發經驗 1. 負責伺服器(Server)相關產品之電子電路設計與開發 2. 板階設計和完成相關周邊零件的選用和設計 3. 對於設計進行自我審查(self-review), 和完成零件廠商所提供的審查清單(review/check-list); 並針對與其他板卡橋接之介面做交叉審查(end-to-end cross review) 4. 除錯及問題排除; 並在問題解決後, 整理分析報告. 5. 執行設計訊號量測與驗證 6. 制定量測計畫和整理量測報告 7. 協助工廠將產品導入量產

✅About the job As a Senior System Hardware Design Engineer, you will drive system hardware design focusing on high-speed interfaces such as PCIe, USB, Thunderbolt, and MIPI, and manage the entire product development cycle. You will collaborate closely with CM/JDM/ODM partners to solve DFM/DFT issues, optimize designs for manufacturability and yield, and ensure high-quality production. You will also be a key contributor in ASIC/SoC validation and system bring-up. ✅Responsibilities: #System Hardware Design & Architecture: • Architect and design hardware platforms with high-speed I/Os (PCIe, USB, Thunderbolt, MIPI). • Lead schematic design, component selection, and architecture definition. • Co-work and support the entire hardware development process with SI companies. #Signal/Power Integrity (SI/PI) & PCB Design: • Perform SI/PI analysis for high-speed signals and power domains to ensure robust performance. • Define PCB stack-up, high-speed routing rules, and work closely with layout engineers. • Review and guide PCB layout and layer stacking for optimal signal/power integrity and EMI/EMC considerations. #ASIC/SoC Validation & System Bring-Up: • Design validation and evaluation boards for new ASIC/SoC platforms. • Collaborate with ASIC/SoC teams to validate hardware interfaces and system functionalities. • Conduct lab bring-up, debug, and hardware validation using high-end equipment (oscilloscopes, VNAs, BERTs). #Productization & Mass Production Collaboration: • Work directly with CM, JDM, ODM partners to bring hardware from prototype to production. • Address and resolve DFM (Design for Manufacturing), DFT (Design for Test), and yield-related issues. • Drive continuous improvement of hardware designs for manufacturability, cost, and quality. • Support pre-production builds, validation, and troubleshooting during ramp-up phases. ✅Qualifications • Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field. • 8+ years of hands-on experience in high-speed system hardware design and development. • Strong design experience with PCIe Gen3/4/5, USB 3.2/4.0, Thunderbolt 3/4, MIPI (CSI/DSI), and similar high-speed protocols. • Deep expertise in SI/PI analysis (tools like Ansys HFSS, Keysight ADS, Cadence Sigrity). • Proficiency with PCB design tools (Allegro, Altium, Mentor Xpedition) and PCB stack-up design. • Solid understanding of ASIC/SoC validation, hardware bring-up, and integration testing. • Experienced working with CM, JDM, ODM partners and managing DFM/DFT/yield issues for high-volume production. • Familiarity with lab instruments for signal measurement, validation, and debugging. ✅Nice to have: • Prior experience in IC design house, OEM/ODM/JDM, or system integrator roles. • Exposure to firmware/software interaction with hardware and system-level integration. • Familiarity with industry compliance standards (e.g., USB-IF, PCI-SIG). • Excellent problem-solving skills and the ability to drive issues across multi-disciplinary team

【成為円星人】 円星科技由一群專業與充滿熱情的夥伴創立於2011年，為積體電路矽智財設計服務業之新秀，秉持著『成為半導體業最值得信賴之IP公司』的願景，追求永續經營與成長。 誠摯歡迎您成為円星人，加入我們，站上國際舞台！ 一起共同打拚，以精品文化之精神，創造價值，追求卓越！ 【職務簡介】 M31主要業務為向 IC 設計業者和晶圓代工廠授權 IP，此職務為負責High Speed interface相關PHY IP進行電氣特性驗證(測試), 功能驗證(測試)之職缺。 【將負責的工作內容】 1. USB, SATA , PCI-e , MIPI PHY 高速I/O介面之電氣特性量測 2. PCB board design for High-Speed I/O interface 3. FPGA board design for High-Speed I/O platform 4. USB, SATA, PCI-e, MIPI C/D/M-PHY高速I/O介面之認證測試 5. 協助Analog/Digital RD進行testchip測試 6. 與合作廠商之Controller進行系統整合驗證與測試 7. 協助客戶進行 FPGA驗證 與 客戶產品之初期驗證 【條件與特質】 1. 擅長工具： -EMC/EMI -FPGA -OrCAD -PowerPCB -USB技術 2. 熟悉USB, SATA, PCI-e, MIPI等高速I/O介面之電氣特性與認證流程 3. 熟悉高速示波器,BERT, ENA & AWG 4. 測試自動化程式(Labview)之規劃與撰寫(option) 5. 認真負責、配合度高 6. Any of following experience are plus -PCB Layout -PCB焊接 7. 有 TV Engineer 相關工作經歷 5 年以上 8. 電機電子相關科系碩士畢業 如果您有以上相關經驗且對此職缺有興趣，歡迎投遞您的履歷！

1. Support customer projects from design-in, design-through to mass-production. 2. Team work with AE, FAE, RD and QA to solve problems.

• Power & Perf measurements under various use-case scenarios, associated debugs, and analysis. • DDR interfaces bring up and qualification activities. • PVT qualification & debug of systems (small and large sample size) intended for testing HW-SW co-working stability. • Electrical measurements of different IO interfaces, first level analysis & debugs • Functional validation of IO interfaces Requirements: • BE/Btech with 1 to 3 years of experience • Clarity on Digital design & Signal integrity basics • Knowledge on schematics and PCB file usage, voltage regulator design concepts • Familiarity with PC architecture, present day interfaces and & interactions of Software (BIOS, Driver & OS) with hardware • Familiarity of working in lab environment and usage of equipment like DSO, Multi-meter, Power supplies. Must know lab equipment specifications and considerations behind them. • Familiarity with scripting languages like Perl/Python • Proficiency in windows & Linux operating systems and Microsoft office tools • Good analytical and reasoning skills

Immersive Optics System Engineer / AR VR Engineer ⭐有機會達到百萬年薪!歡迎對外商感興趣的你，保障年薪13.5個月⭐ Responsibilities: Provides expert knowledge regarding the selection, evaluation, qualification and procurement of visual system in different varieties of display size applications. Collaborates and communicates with internal and outsourced development partners about design requirements, regulatory requirements, and user needs. Participates as a member of project team of other engineers, Program Managers, and internal and outsourced development partners to develop reliable, cost effective and high-quality solutions for the immersive visual system products. Experience on NPI and manufacture process. Familiar with display industry production. EE experience to bring up the display system (including MIPI / Vx1 / eDP etc…). To review the EE design with supplier and system designer. Knowledge of HDMI and DP. Education and Experience Required: MS in Display Engineering, Materials Science, Optical Engineering, Physics or related field and/or equivalent experience. Typically 5+ years experience, with 3+ years at related field. Knowledge and Skills: Solid knowledge in different form factor product. Such as VR/AR, Monitor, TV, AIO etc. Display design (Array / FEOL / BEOL) and quality control Display system hardware design. Basic knowledge of Geometrical optics and Optical imagery. Camera ALS / Proximity Sensor Depth sensing (Structure light/TOF) Good communication skills in English and Mandarin with ability to work under pressure. Proven track of record on development and implementation of innovative LCD, AMOLED, or other display solutions for consumer electronics. Experience with at least one of the focus areas of visual system technology below: -VR display system (Panel + Lens) -Video passthrough system (Dual camera + ISP) -AIO touch monitor system -IWB system -SLAM system (camera + sensor fusion)

1、主導ATE硬件系統設計，包括模數混合電路、電源管理、信號完整性（SI抖PI）分析，優化EMC抖EMI性能。 2、對公司ATE設備硬件性能指標，穩定性指標，可靠性指標負責，按質量達成客戶指標要求 3、指導硬件工程師與FPGA聯調，完成硬件層技術支持，確保系統功能及性能達標。 4、有豐富硬件設計經驗，調試經驗以及芯片測試DFT設計經驗。 5、對ATE硬件系統進行標準化，提供硬件設計文檔、測試規範及調試報告，確保設計可追溯性，可維護性以及易交互性（易於被軟件調用）。 6、對ATE測試機硬件的規格書進行校對與維護，包括硬件使用指導客戶培訓等相關事宜的協調與溝通 任職要求： 1、電子相關專業本科十年以上，精通Ca鬥ence軟件進行電路設計，並能結合仿真結果分析後進行改進電路 2、有紮實數字電路和模擬電路基礎，有豐富模擬抖混合信號IC設計電路DFT開發經驗，設計過大型模數混合系統的硬件電路。 3、有過大功率直流電源系統設計，並調理過直流精密小信號質量的成功經驗。 4、使用示波器、邏輯分析儀等工具進行硬件調試，分析信號完整性、電源噪聲，改進電路和信號質量 5、能夠結合fpga獨立設計整個ATE硬件系統，熟悉pcie總線和Trigger總線，並指導下壹級工程師進行硬件子模塊設計開發。 6、主導過高精密直流硬件電路設計和調試，有過完整FCT、ATE等電性能測試設備的硬件設計經驗者優先 7、對行業內ATE測試機的性能指標有所有了解，能夠根據行業內的ATE測試指標提出公司未來發展的技術路線

ᴘᴜʀᴘᴏsᴇ ᴏғ ᴛʜɪs ᴘᴏsɪᴛɪᴏɴ Based on the goals and needs set by the organization, we focus on research and development of industrial Ethernet switches and related applications to solve technical challenges, improve product performance and reliability, promote continuous progress of the team, meet market needs, and ensure that Complete all tasks within time schedule. You will be a hardware project leader to response for all aspects of the product development cycle including SPEC definition, prototype implementation, issue analysis, work on new products with various cross functional teams. You will also be involved with research, investigation, and definition of new areas of technology. ᴍᴀᴊᴏʀ ᴀʀᴇᴀs ᴏғ ʀᴇsᴘᴏɴsɪʙɪʟɪᴛʏ - Schematic design - including architecture design, critical component selection, electrical stimulation. - Board layout - including PCB stack up definition, component placement, detailed routing rule setting. - System verification and validation, reliability testing. - Analyze and resolve the design issues in prototype stage. - Familiar with related EMI/EMS testing and debugging. - Work closely with PM, SW, ME, Thermal, SI, EMC, DQA to ensure the integration. Perform other related duties as assigned.

Years of experience needed: 5+ Years Technical Skills: · Experience in x86/ARM-based PCBA system schematic design, layout review, and BOM management. · Excellent analytical and problem-solving skills. · Excellent English writing and good presentation skills. · Excellent interpersonal (one on one), teamwork (one on team) and collaboration (team to team) skills. · Familiar with key functions/specs of PCA EE/power components and the architecture. · Excel skillset – VBA, Macros, pivot tables and charts, advanced Formulas (Vlookup, Index+Match, Sumif), conditional formatting. Microsoft Project, sharepoint knowledge is nice to have. Job Description · Participate in the creation of the PCA BOM of both HP & competitive products thru design review, component observation & definition of functional blocks. · Obtain EE related BOM cost estimates from cost models, benchmarks and RFI quotes. · Collaborate with HP operations to estimate cost of HP & competitive products. · Partner with suppliers and others in HP operations to understand the technology and develop cost models/benchmarks. · Provide domain-specific expertise and overall electrical/electronic hardware and platform leadership and perspective to stakeholders. · Evaluate and propose the cost-saving opportunities after the competitive analysis. · Present the EE competitive analysis results in cross-organizational review meeting. · Guide and mentor less- experienced EE members. · Provide EE unit design/cost analysis to the HP teams and assist in developing competitive products. Certifications Needed: · Bachelor’s or Master’s degree in engineering field.

職務介紹： 做為一名硬體研發工程師，您將負責產品評估、硬體規劃及設計，Layout佈局及走線檢查，電子電路訊號量測及除錯系統設計，零件料號申請、BOM表建立與修改，以及專案技轉量產，品質分析等。主要產品為Intel /AMD Server, x86 Motherboard, ODM專案等產品開發。 職務匯報： 此職務會匯報於研發主管 主要工作內容： 1. 電子電路之研發，新產品設計，硬體除錯，良率提升等工作 2. 硬體線路及工程樣品製作 3. 研發新產品，改善現有產品，改善作業流程 4. 與客戶或公司的硬體部門的同仁共同研發或解決問題 5. 舊專案維護或改良，BOM變更與維護 人才需具備： 1.工作經驗：3年以上Server/PC/Notebook相關產業x86硬體研發經驗為佳 2.學歷要求：大學、碩士 3.科系要求：電機電子工程相關為佳 4.語文條件：英文(讀:中等、寫:中等) 5.擅長工具：擅長OrCAD, Allegro 等EDA軟體、Microsoft Office 軟體和示波器、電表等儀器之操作 6.工作技能：電子零件及電子線路解析能力 7.其他條件：細心、思考靈活，積極主動，良好的溝通能力，富有團隊合作精 神以及強烈的學習意願也是我們重視的條件。

主要負責 1. 產品線路設計 2. 產品 PCB佈局設計 3. 生產 BOM發行 4. 零件評估選用 5. 產品 bring up onsite support 6. 產品功能性驗證, 製作測試報告 7. 產品 issue 分析 debug 8. 與 SI/ME/SW/Compliance/Thermal team 合作產品設計 9. Design study and Design proposal