1. Flip chip package substrate design.
2. Capable provide optimization design proposal.
3. Capable to co-work with substrate/material suppliers directly.
4. Design rule maintenance.
5. Work closely and Interface with various teams (product, PE group and supplier…etc)
6. A plus for Good command of written and oral in English.
1.Analog and mixed mode circuit layout and verification
2.Co-work with designer for layout floor planning,routing and physical verifications
3.command file maintain