「微機電元件研發工程師」的相似工作

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.CIS pixel device design 2.process flow setup 3.implant condition design 4.pixel layout 5.color filter/ micro-lens design 6.characterization plan 7.silicon data analysis and performance improvement

1. 使用CREO繪圖軟體將設計3D圖修改成適合模擬的圖檔，利用聲學模擬軟體 COMSOL 進行設計驗證。 2. 與設計工程師討論產品設計問題，並給出改善建議。 3. 須使用聲學量測儀器與設備 (Klippel & SoundCheck)，驗證模擬的準確性。 4. 可配合出差客戶端，與客戶討論模擬問題。

Context The Customer Support (CS) organization is responsible for the installations, qualification, repair and maintenance of the ASML systems at customer sites and is responsible for the necessary transfer of know-how to the customer. Local site Customer Support branches perform these tasks for the customer within the specific region. The Field Service Engineer 2 executes regular and irregular maintenance activities with considerable independency and under limited supervision. Handles defined and regular problems/maintanance on a machine, either independently or through escalation without supervision. Requirements Experienced Field Service Enginer with BSc degree in relevant Technical Field (Electrical Technology, Mechatronics, Mechanical Engineering, etc.) or equivalent experience. Experienced in technical industry is required and/or semiconductor industry experience prefered. Experience in using computer applications, including data analysis tools, spreadsheet, and presentation software. Has complete knowledge on product functionality of the main modules/sub-modules. Responsibilities Problem analysis and approachGather all information relevant for the problem, analyze using available means, gather additional diagnostic info if needed, decide on initial approach to solve problem and execute, consult with others. Problem handovers and routingHandover problem or problem aspects to others (2nd line support), document and package all data relevant for problem resolution (e.g. pass-downs, work orders, field service reports, system problem reports, technical reports). RepairsUse tools, replace parts, improve settings, to execute repairs and standard service actions independently. ProceduresBased on arranged customer machine time window to arrange for all (possible) parts, tools, equipment and information / knowledge to be available at start of procedure, execute procedure. Training / adviceExplain appropriate actions to users to correct malfunctions, train customers in use and routine maintenance of equipment, recommend changes in user procedures when needed Process OptimizationSignal gaps and improvement opportunities and reports it to the relevant stakeholders Knowledge build-up and transferMaintain and broaden own knowledge, shares best known methods within the work group. CoachingProvide appropriate support and assistance to less experienced engineers on first tasks. Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1. 射束線磁格設計與開發； 2. 射束線模擬(MAD, OPAL, COMSOL simulation, CST studio simulation, etc. )； 3. 實驗加速器物理。

- Development acoustic products like wired/wireless headsets and speakers, conference call systems, hearing aids related products - Join audio algorithm tuning and optimization - Encouraged to propose audio conceptual ideas and patents - Co-work with Hardware, ME and firmware team to implement acoustic system products

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

MaxLinear is seeking a Staff Product Engineer to join our growing team in Taiwan. In this role, you will be responsible and focus on the following: • Full product life cycle ownership • Co-define ATE test, characterization, qualification, manufacturing plans • Co-define test spec and control limit • Co-work on CRAs analysis • COGS analysis and reduction • Data and yield analysis and improvement • Co-work with internal cross-functional teams and OSATs

【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047 1. 封裝產品切割。 2. 切割、超音波掃描設備保養維護、異常排除、效能改善。 3. 封裝切割製程改善與開發。

The Role: This position will be on-site at the Logitech office in Hsinchu, Taiwan. You will be a member of our global Acoustics team working on audio projects across multiple product categories. Your primary focus will be new product development including design, validation, and certification as a member of cross functional teams. Your Contribution: Be Yourself. Be Open. Stay Hungry and Humble. Collaborate. Challenge. Decide and just Do. Share our passion for Equality and the Environment. These are the behaviors you’ll need for success at Logitech. In this role you will: • Lead projects for acoustic development and implementation of hardware across speaker, headsets and voice communication devices • Work with transducer developers to optimize performance • Collaborate with ME, EE, FW, DSP teams to optimize audio integration • Characterize audio systems using objective and subjective metrics to ensure the desired end user experience • Collaborate with the algorithm developers to optimize audio/voice performance and tunings • Partner with Engineering/ In-house operation/ OEM/ODM/CM to resolve manufacturing issues • Mentor other engineers

1. Foundry co-work and contact window. 2. Handle co-development of power, MCU related applications , mass production & yield ramp up . 3. It's better with Foundry process integration or product experience.

Tcad模擬、元件量測與分析

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

1. 具備矽光子相關 EDA 版圖設計軟體 使用經驗（如 Cadence Virtuoso、Synopsys OptoDesigner、Luceda IPKISS 等）。 2. 熟悉矽光子 光學模擬與設計優化，能操作 Lumerical FDTD / MODE / INTERCONNECT 等模擬軟體，並具備量測與驗證能力。 3. 具備矽光子 / 光學測試 / 光學元件開發與設計相關經驗。 4. 具有良好的技術文件撰寫能力，能清楚表達設計思路與實驗結果。

1. Ensure PKG design is optimized with SI/PI/Thermal requirements. 2. Create the PKG/RDL/Subtract SI 3D modeling and perform extraction of S-Parameters and RLGC model. 3. Full-wave modeling of VIAs, Connectors, Package and PCB channels, components using 3D full-wave EM tools. 4. Provide the CM(Construction rules) and Design Rules(guidelines) for the PKG/RDL/Subtract design. 5. Provide the Substrate manufacturing process and material property. 6. SI(Signal integrity) simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise. 7. PI(Power integrity) analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis to meet the silicon noise spec, decoupling strategy and analysis. 8. CTK(Crosstalk) analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB. 9. SSN(Simultaneous Switching Noise)/SSO analysis for I/O (DDR5/4/3, LPDDR5/4/3, etc.) power domain. 10. Eye diagram(ZRZ/PAM4) and jitter analysis for CPS(Die Chip-PKG-System PCB) co-simulations. 11. Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements. 12. Familiar with assembly and substrate manufacturing process is a plus. 13. Familiar with programming/scripting in Java, VBScript, PERL, TCL, MatLab and/or equivalent. 14. Experienced in SI PI automation tool development with Python or PyAEDT is a plus. 15. Working with ASIC/HW/Production team.

1. Audio, Speech Recognition, Communication quality validation and analyzing. 2. Specification/Procedure/Regulatory research and development. 3. Test sequence/quality improvement and automation. 4. Training courses delivering. 5. Customer consulting and service.

1. Electrical package warpage and component stress simulation and analysis (FBGA, FCBGA, FOWLP, FOPLP, 3D IC CIS CSP, TSOP, QFN, QFP......). 2. Electrical package thermal simulation and analysis (JESD51 standard). 3. Electrical package mold flow and wire sweep simulation and analysis. 4. Board level drop test experiment and analysis (JESD22-B111 standard). 5. Warpage measurement by shadow moire (JESD22-B112 standard). 6. Database establishment and utility development. 7. New simulation capability development. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

【職務說明】 我們是一條以AI 驅動的先進封裝產線，專注於 MicroLED 與 VCSEL 的巨量轉移、檢測與修補，致力於打造下一世代的 先進顯示技術與矽光子應用。我們正在尋找一位具備強大實驗設計能力與動手實作精神的研發工程師，投入新世代巨量轉移方法與設備開發，攜手跨部門團隊解決關鍵製程挑戰，並透過數據分析與模型建立，驅動良率與製程穩定性的持續提升。這將是您參與下一代顯示與矽光子應用關鍵技術突破的絕佳機會。 【工作內容】 1. 參與 MicroLED 巨量轉移製程技術開發與優化，包含 Laser Lift-Off、Stamp Transfer、Electrostatic Transfer、Fluidic Assembly 等方法。 2.研發與改良轉移設備，熟悉 pick-up / release 原理並能與機構、光學、控制團隊合作開發自製設備。 3.建立並優化 MicroLED 製程，熟悉 LED 結構、製程、特性與測試，解決製程中常見失效模式（破片、黏附力不足、位置偏移等）。 4.設計與執行 DOE，建立良率模型，進行參數優化，提升製程穩定性與良率。 5.操作與分析各類實驗工具（光學顯微鏡、AOI、3D Profiler），並能熟練使用 Python、JMP、Excel VBA 進行數據處理與可視化。 6.撰寫與呈現中英文技術報告、簡報，參與跨部門專案討論與對外客戶技術提案。 7.與設備、製程、設計、品管等跨部門團隊緊密合作，追蹤專案進度與推動問題解決。 8.針對巨量轉移相關新材料、新技術進行研究探索與技術前瞻評估。 【必備專業技能】 1. 熟悉以下一至多項技術方向： • 巨量轉移方法：Laser Lift-Off、Stamp Transfer、Electrostatic Transfer、Fluidic Assembly等 • 轉移設備開發與優化：熟悉 pick-up/release 原理與自製設備設計 • 熟悉LED 結構，製程，特性 • 熟悉製程良率管理與失效分析（如破片、黏附力不足、位置偏移） 2. 具備高度動手能力與 troubleshooting 能力 3. 跨單位（設備/製程/設計/品管）協作與專案追蹤能力 4. 能撰寫中英文技術報告與簡報，參與客戶端或內部技術提案 5. 對巨量轉移新技術、新材料具研究熱忱與技術前瞻思維 【實驗與分析能力】 1. 能設計 DOE、建立良率模型、進行參數優化 2. 熟練使用： 光學顯微鏡 / AOI / 3D Profiler/ Python / JMP / Excel VBA 等分析工具

1.負責 MEMS 元件製程開發與製作（黃光微影、薄膜沉積、乾蝕刻、晶圓鍵合等）。 2.與設計工程師合作，根據模擬設計導入量產製程。 3.分析與改善製程良率，提出製程優化方案。 4.協助進行樣品測試、失效分析與可靠度驗證。 我們誠摯邀請充滿熱情且經驗豐富的MEMS製程工程師加入領先業界的團隊！如果您對半導體及微機電有深厚知識，渴望投入尖端技術開發、追求卓越產品良率與效率，歡迎與我們一起開創未來！

1. 能針對產線與應用需求提出有效方案。 2. 熟悉雷射原理與相關量測技術(有架設光路經驗者尤佳)。 3. 熟悉光纖元件製成與技術(熔接, 耦合, 拉錐)。 4. 可配合支援產線之工作 。 5. 具數據分析與模擬能力(會使用Matlab, Python尤佳)。 6. 完成上級主管交辦之事項。