1. Performing DC IR drop and AC impedance simulation.
2. Improve simulation/validation efficiency and performance by automation.
3. Execute SI/PI/RF/EMI verification for the system requirements.
4. Build up SI/PI simulation and measurement correlation database.
5. Build up design and test capability including design guidance and lab setup.
6. Working with HW teams to optimize high-speed signal.
Summary:
Part of design automation team to enable and verify Printed Circuit Board (PCB) hardware and layout designs.
Essential Duties and Responsibilities:
• Execute Power Integrity (PI) tools and provide inputs to design and lab teams
• Execute Signal Integrity (SI) tools and provide inputs to design and lab teams
• Develop scripts to provide solutions in design and PCB manufacturing issues
• Define and develop design methodologies to improve design quality and productivity
• Engage with Computer Aided Design (CAD) tool vendors for tool evaluation and support
• Engage with PCB and CM vendors to understand and evaluate PCB materials and stackups
• As a SI engineer you will work with our internal Sr. SI and product development engineers of different Bus for customers’ inquiries.
• Assist in optimizing customers’ pcb footprint and generate SI report of channel simulation.
• Provide SI strategies for customer pinouts and routing challenges.
• Help to measure customers’ circuit boards or in-house test fixtures for verification or debugging of our products.
【產品範疇】
1.DDI / TP / TDDI/ TCON/ Power等顯示相關產品
【工作內容】
1. SI/PI/EM issue solving, performance optimization, and design rule development
2. Chip/PKG/Board simulation and measurement for SI/PI/EM issue.
3. Co-work with system engineers, IC designers, and customers on product design-in tasks.
Purpose of this Position
深入研究高速訊號,在高速硬體電路Signal Integrity上提供最佳設計且確保生產品質
Major Areas of Responsibility
專案研發
- Perform high speed signal integrity simulation including 10G/40G、25G/100G、PCIE、SATA、DP、USB、DDR3/DDR4/DDR5.
- Perform pre-layout, layout constraint, and post-layout simulation processes.
- PCB stackup design and layout review for high speed signal and PDN.
- Build component models to ensure the correlation between SI/PI simulation and measurement.
- Solid SI experience in resolving technical issues and performing detailed analysis.
團隊合作
- Collaborating with EE teams to refine high-speed signal performance.
- Collaborate with the layout engineer to provide clear layout guidelines and enhance footprint optimization.