•Design multilayer PCBs for camera, thermal, LiDAR, LRF, and gimbal modules
•Collaborate with IC engineers to implement signal routing and power delivery
•Perform schematic capture, layout, and DFM/DFT reviews
•Validate board performance through EMI/EMC and thermal testing
•Support rapid prototyping and production ramp-up
Focus: Electrical design and integration of camera/sensor modules into PCBs.
1.Layuot設計,PCB發包製作,SMT/DIP發包製作。
2.研究製作PCB產品相關分析與報告。
3.協助技術文件編寫。
Job Description
1.Layout design, PCB outsourcing and production, SMT/DIP outsourcing and production.
2.Research and create analyses and reports related to PCB product manufacturing.
3.Assist in the preparation of technical documents.