「【JDS】Lead Electrical Design Engineer(Ethernet Switch)」的相似工作

Electrical Principal Engineer (Embedded Power and Batteries) Our Electrical Engineering team puts the spark into the full hardware development lifecycle, from concept to production. It takes experts in system architecture definition, design, analysis, prototyping, sourcing & the debugging and validation of layouts or routes to deliver state-of-the-art products for a changing world. We work closely with designers, cross-functional teams within Dell Technologies and suppliers to make sure electronic designs meet a range of requirements, including schedule, feature set, functionality and quality, as well as industry standards. Join us to do the best work of your career and make a profound social impact as an Electrical Principal Engineer (Embedded Power and Batteries) on our ISG Core Hardware Development Team in Taipei. What you’ll achieve Participate in the development of next-generation large-scale AI Infrastructure with focus on power systems architecture development – 48V and 12V DC Power Distribution Network design and analysis, DC-DC Power Conversion, Li-Ion battery back-up devices, bus systems, etc. Engage with global multi-disciplinary cross-functional teams to deliver innovative, high-performance, high-reliability and secure solutions for our customers. You will: Provide technical planning guidance on key power system technologies and design development processes aimed at improving innovation, automation, agility, team efficiency, and quality; specify high-power/high density 48Vdc Intermediate Bus Conversion (IBC) products Design power systems for Storage/Server products including power architecture design, CPU/DIMM VRD design and Intel CPU VRTT validations, power related analog circuit design, Li-ion battery charging/discharging circuit design; specify procured components and sub-assemblies, including dc/dc modules, dc/dc point-of-load converters, power semiconductor and passive components, battery backup systems Provide technical program management to include proposal review, project planning, issue tracking and global supplier management (both power semiconductor suppliers and ODMs)

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

Has lead experience for X86 or GPU system. 1. 獨立(或領導一個團隊)負責伺服器(Server)產品之電子電路設計與開發 2. 能進行新技術/概念/晶片世代的研究並透過新案子實踐並提供符合(或超越)市場需要之產品設計 3. 審查設計及驗證之相關文件(Schematic/Layout/Validation Repot/Issue-analysis Report/Product specification…etc.) 4. 產品除錯及問題排除 5. 在不影響產品品質的前提下, 有效率執行設計研發流程; 並將價格(cost)和品質(quality)兩者都放進設計考慮中. 6. 能同時執行多個專案目標並成功完成 7. 能推動跨組織討論,有效率解決技術問題,並主持與客人之技術討論 8. 協助引領團隊並協助其他成員解決問題

Job Summary: 1. We are looking for a highly skilled and experienced Senior Hardware Design Engineer to join our server development team in Taipei. 2. The ideal candidate will be responsible for high-speed hardware design, schematic capture, debugging, and working cross-functionally with layout, validation, firmware, and manufacturing teams to deliver high-quality server products and add-on cards. Key Responsibilities: 1. Responsible for schematic capture, layout review, BOM generation, and debugging/testing of server motherboards and add-on cards. 2. Collaborate with layout engineers, BIOS and firmware engineers, validation and test engineers, and cross-functional teams to identify and resolve engineering issues early in the development cycle. 3. Participate in and contribute to design reviews, architecture discussions, and project planning. 4. Prepare and maintain technical documentation, including product specifications, layout guidelines, test procedures, and design review reports. 5. Ensure product compliance with engineering specifications, safety, and energy regulations if any (e.g., ErP), and customer performance expectations. 6. Provide clear documentation and technical support to contract manufacturers and production teams during prototype and mass production stages. 7. Lead root cause analysis and provide corrective actions for hardware-related production or field issues. Required Qualifications: 1. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 2. Minimum 5 years of experience in hardware design for server, PC, or embedded systems. 3. Proficient in schematic capture tools (e.g., OrCAD). 4. Solid understanding of high-speed signal integrity, power delivery design, and board-level debugging. 5. Hands-on experience with lab equipment such as scopes, logic analyzers, and multimeters. 6. Strong problem-solving and analytical skills. 7. Good communication and documentation skills in both English and Mandarin.

Responsibilities include: 1. Act the staff/sr. role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

Job Responsibilities: 1. Following R&D product design process to implement the hardware design. Ability to communicate clearly with team members and teamwork skills. 2. Cooperate with a cross-functional team of Engineers (EE, software, Thermal, mechanical, CAD, DFX, Test, etc.) and others in the development and support of new product introductions. 3. Serve as the senior technical advisor for the product line for the end-to-end life cycle of the product. Ensure operations technical readiness for all phases of the introduction cycle. 4. Identify, prioritize and manage key technical changes and risks of a given product; ensure all technical risks associated with a product are identified and closed or mitigated to enable the quality ramp of a product. 5. Review and submit all equipment requirement plans, along with an assessment of the robustness of the solution to meet the requirements of the operation, and the implementation of any additional solutions to mitigate any risks to the plan. 6. Deriving the functional specification and architecture for a subsystem or circuit pack based on system requirement. 7. Component selection/qualification; interacting with electrical/optical component vendors. 8. Documenting all technical design files. 9. Logic thinking and communication with customers Qualification: 1. A university degree in EE/CS, or a master’s degree is preferred. 2. With 8+ years relevant experience, preferable in communication product design and applications, such as datacenter switch, router, carrier switch, etc. 3. Experience with key switch silicon, such as Broadcom, Marvell, Cavium, etc. Experience in communication interface, such as XAUL/GMII/SGMII /XFI/PCI/PCI-E/ buses required 4. Knowledge on high-speed design, 25G SERDES is preferred 5. Experience in product testing, certification. 6. Excellent understanding of digital hardware design, power design, and high speed interfaces, timing analysis and signal integrity issues. 7. Understanding of analog electronic concepts and EMC. Can supervision of layout design. 8. Working knowledge of Concept schematics capture, Signal Integrity simulation, Verilog HDL, familiarity with Allegro. 9. Experience with high volume run products, test and verification of circuit packs designed. 10. Supporting new product introduction/transition to EMS. 11. Be familiar with EDA tools such as OrCAD, Concept HDL, Allegro etc. 12. Good communication skills, English language proficiency

1. Ethernet Switch hardware design, debug, evaluation, and verification 2. Responsible for PCB material selection (SI/PI considered), schematics design, PCB layout constraint & review, HW DVT test and 2nd source verification...etc. 3. Writing and maintaining the hardware specification of the projects, failure analysis report if needed 4. Study tools & instruments for design & validation

1.新產品硬體開發相關作業 2.產品硬體設計驗證。 3.零件承認。 4.新產品技轉作業。 5.其他主管交辦任務。

1.領導硬體開發團隊，規劃並執行從概念到量產的硬體開發流程 2.評估並選擇初期開發平台（如 Jetson Orin），制定整合 ArgusPTZ 軟體的系統架構 3.主導自研主機板或控制板設計，包括電路設計、Layout、選料與成本優化 4.管控開發進度、供應商協調與量產品質 5.與軟體、產品經理密切合作，確保系統整合完整性與技術可行性 6.長期硬體研發規劃 7.主管交辦事項

1. In-depth knowledge of PCB layout, OrCAD/Allegro tools, circuit design, and PCB structure. 2. Prepare technical documentation including product specifications, layout instructions, test procedures, etc. 3. Transfer products to manufacturing with clear documentation and help C.M. and technical support to solve problems. 4. Hardware engineer need co-working with PM, BIOS, IPMI, EMI, Thermal, ME RD friendly. Need have good team work. Need to have the concept of project ownership. 5. Need have power VR and component design knowledge 6. Resolve complicated issues and drive to root cause on critical engineering problems

1. 負責硬體開發時程/設計/測試 2. 前端RFQ評估/回覆，並提出產品規格的規劃與分析 3. 統合整體專案的進度與Schedule 4. 執行專案開發過程設計問題的除錯分析 5. 零件料號申請、BOM表建立與修改 6. 跨單位研發團隊合作開發設計、量測驗證、認證、問題協調及解決 7. 協助工廠導入專案量產

[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. We are seeking a PCB Design Engineer with strong theoretical foundation and simulation driven design methodology to lead high speed board level development. You will be responsible for defining and verifying board level electrical design, ensuring optimal signal integrity across multiple high speed interfaces. You will be supported by experienced layout engineers capable of implementing your design guidance and constraints, allowing you to focus on PCB circuit design and system validation. This position offers the opportunity to build structured PCB design practices, improve team capability, and drive electrical excellence through direct ownership of simulation and cross team collaboration. [Responsibilities] ★ Lead system level PCB electrical design for interfaces such as LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Define PCB stack up and routing strategy to meet signal integrity objectives. ★ Perform circuit level simulations using tools such as PSpice. ★ Own schematic level electrical planning and define layout constraints for critical signal groups. ★ Provide guidance to supporting layout engineers to ensure adherence to electrical rules and best practices. ★ Correlate simulation results with lab measurements and assist in electrical issue root cause analysis. ★ Document simulation methodology constraint guidelines and validation reports. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Familiarity with differential and single ended routing across LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet. ★ Proficiency with layout tools such as Allegro. ★ Exposure to EMI mitigation techniques and hands on experience in EMI pre compliance testing. ★ Demonstrated ability to lead layout teams or mentor junior engineers in constraint based PCB design. ★ Ability to create structured documentation and design guidelines to scale internal processes. ★ Strong debugging and problem solving skills with working knowledge of firmware and software to support system level root cause analysis. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.

THE ROLE The Lead Signal Integrity Engineer is a technical leader responsible for advancing Isola’s laminate materials to meet and exceed high-speed electrical and signal integrity (SI) performance requirements. This role provides mentorship and direction to the Signal Integrity team in Taiwan, drives innovation in SI test methodologies, and ensures strong technical engagement with global OEMs. The Lead serves as a recognized authority in SI, bridging customer needs with material performance and representing Isola in the high-performance electronics community. KEY RESPONSIBILITIES: Customer-Facing Technical Support: • Lead technical engagement with OEMs and direct customers on high-speed laminate characterization. • Act as primary technical contact for SI-related design validation and adoption cycles. • Oversee the creation of technical reports, white papers, and collateral for internal and external use. Strategic & Technical Leadership: • Define and develop advanced SI measurement, modeling, and simulation methodologies. • Collaborate with Product Management, R&D, and Sales to ensure alignment of SI capabilities with product strategy. • Represent Isola as a thought leader through publications, conferences, and industry forums. Organizational Management: • Mentor, guide, and grow the Taiwan-based Signal Integrity Engineering team. • Establish scalable, cost-effective SI test methods that accelerate R&D and customer response. • Drive alignment with global Application Engineering teams to ensure best-in-class technical service. Technology & Standards Thought Leadership: • Maintain expertise in SI methods, PCB processing effects, and high-speed digital design requirements. • Contribute to industry standards development and support customer forums on SI requirements. QUALIFICATIONS & EXPERIENCE • 8+ years of experience in signal integrity engineering, PCB laminates, or high-speed design. • Expertise in VNA measurements, probing techniques, and advanced SI methodologies. • Experience with PCB manufacturing and processing effects on SI performance. • Demonstrated leadership and mentoring experience. • Proven record of technical publications, white papers, or conference presentations. EDUCATION • PhD or Master’s in Electrical Engineering or related field required. OTHER CONSIDERATIONS • Fluent in English – required for global communication and technical documentation. • Proficiency in Mandarin Chinese – strongly preferred for engagement with Taiwan/China teams and customers. • Ability to travel regionally and globally as needed.

About the Role - Arizon RFID Technology is a global leader in RFID solutions, serving some of the world's largest retail and industrial customers. We are ARC-qualified by Auburn University RFID Lab, ensuring our products meet the highest global standards. We are seeking a hands-on technology leader to drive our R&D efforts, with a strong focus on RFID antenna and inlay design. This person will lead innovation, guide our R&D team, and ensure Arizon stays at the forefront of antenna performance and ARC compliance. Key Responsibilities - Technology & R&D Leadership • Lead the R&D team in designing, developing, and optimizing RFID antennas (UHF near-field and far-field) and inlays for diverse applications. • Define and execute Arizon’s technology roadmap, aligning R&D priorities with business strategy and customer needs. • Oversee prototyping, testing, and transition from design to mass production, ensuring manufacturability and cost efficiency. • Maintain and expand ARC qualification across product categories by driving antenna design that meets Auburn University RFID Lab testing standards. • Monitor global RFID technology trends (materials, chipsets, antenna design, printing, packaging) and identify opportunities for innovation. ARC & Compliance - • Ensure continuous compliance with ARC program requirements, leading projects to expand category coverage. • Collaborate with Auburn University RFID Lab, certification bodies, and major retail clients to secure and sustain ARC qualifications. • Integrate regulatory and performance standards into the design cycle (US/EU/Asia frequency bands, durability, environmental testing). Cross-Functional Collaboration • Partner with Product Management, Manufacturing, and Sales teams to deliver customer-ready solutions that balance performance, durability, and cost. • Support customer engagements where deep technical input on antenna design or ARC performance is required. • Liaise with global production centers (China, Taiwan, Vietnam, US) to align R&D output with manufacturing capabilities. Team & Organizational Leadership • Build and mentor a high-performing R&D team with strong antenna and RF engineering capabilities. • Establish best-practice processes for R&D, prototyping, and lab testing, ensuring agility and scalability. • Champion intellectual property (patents, know-how) in antenna and RFID design to strengthen Arizon's competitive position.

請提供[英文履歷] 此職缺 負責 Server Lab 測試作業完整循環：待測物與伺服器收發、環境建置、點焊/量測、硬體更換、網路佈線、功能與訊號測試，並與跨部門/跨國團隊協作，確保設備運行穩定。 工作內容 - 建置測試環境（伺服器機架安裝、韌體/BIOS/OS 基礎設定），支援後續測試。 - 主機板待測點焊接（含 0402/0201 等級）或量測點臨時導出製作。 - 使用示波器、分析儀、萬用電錶等進行訊號/功耗/功能量測。 - 伺服器零組件更換（HDD、SSD、RAM、風扇、線材等）、故障排除。 - BIOS Log / Error Log 蒐集、初步判讀與問題分類。 - 使用 SSH、console 等工具檢查設備狀態，並進行伺服器功能測試。 - 待測伺服器，備品與零件庫存進出庫與標示、紀錄、資產管理。 所需專業與技術 - 電子 / 電機 / 資電相關科系畢業。 - ３年伺服器或 PC / Notebook 硬體測試或 Lab 支援經驗。 - 能閱讀線路圖 / PCB Layout 基本結構，熟悉小尺寸料件（0402/0201）焊接或測點引出。 - 實務訊號量測經驗：示波器 / 分析儀 / 負載設備操作。 - 了解 BIOS / 系統錯誤 Log，能進行初步分析。 - 硬體故障排除流程：拆解、定位、零件判別與更換。 - 接觸並實際使用之設備類型（至少數項）： Digital Power Supply, Oscilloscope, Frequency Counter, Logic Analyzer, E-load, Multimeter, Network Analyzer, Call Box, Chamber, Spectrum Analyzer, IR Camera, Thermal Coupler。 - 基本 Linux 指令與遠端連線（SSH / Serial Console）經驗。 優先考慮 - 伺服器平台（含機架式 / 雲端伺服器）整機測試或系統驗證經驗。 - 基本網路設備設定(Switch VLAN / Link Aggregation / IPMI / PXE Boot)。 - Thermal / Power / Signal Integrity 基本觀念。 - 能獨立規劃並執行任務，適應多工與快速節奏

1. 工業用電腦主機板設計開發 2. 產品樣品階段測試驗證 3. 零件資料收集與管理 擁有 x86 硬體設計開發經驗的你(妳)，正在尋找下一個職涯發展的舞台嗎？ 廣積科技深耕工業電腦領域，產品應用涵蓋多個垂直市場，並已融入日常生活。加入我們，你(妳)將深入了解各產業的應用環境與法規，設計符合終端客戶需求的創新產品。 如果你(妳)對這個領域充滿熱忱，歡迎投遞履歷。

具備 1~5年 X86或GPU硬體研發經驗 1. 負責伺服器(Server)相關產品之電子電路設計與開發 2. 板階設計和完成相關周邊零件的選用和設計 3. 對於設計進行自我審查(self-review), 和完成零件廠商所提供的審查清單(review/check-list); 並針對與其他板卡橋接之介面做交叉審查(end-to-end cross review) 4. 除錯及問題排除; 並在問題解決後, 整理分析報告. 5. 執行設計訊號量測與驗證 6. 制定量測計畫和整理量測報告 7. 協助工廠將產品導入量產

Welcome to apply from NVIDIA Career page: Server: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Taiwan-Taipei/Senior-System-Application-Engineer_JR1996786-1 Notebook: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Taiwan-Taipei/Senior-System-Application-Engineer_JR1996805 We're Application Engineering team and searching for System Engineer to engage for partner development in ARM-based (Grace CPU) and X86-based servers with NVIDIA solutions. NVIDIA is creating the future of computing and looking for passionate, dedicated, and forward-thinking individuals to help make that happen. What you’ll be doing: - System-level tool development/debug from the product segment needed. - Join the partner design review through system architecture, schematics, and layout, thermal and validation plan. - Work with partners for issue analysis and root cause. - Drive with partner's design quality. - Provide tech training to customers. - Overseas travel will be required if needed. What we need to see: - Master's Degree or equivalent experience in Computer Science/Computer Engineering/Electrical Engineering or related field. - 5+ years of server or PC design work experience. - High-Speed Signal design/ Strong knowledge of GPU Server System Architecture includes X86 and ARM-based. - Familiar with Linux. Good concept of thermal and mechanical design. - Skills of ARM Server System Architecture are a strong plus. Skills of Python/Perl is a plus - Knowledge of the PCIe architecture with AER (Advanced Error Reporting). - Excellent communication skills, flexibility in task assignments, and working under pressure. - Strong communications skills in English, Innovative, Independent, results-oriented problem solver. Ways to stand out from the crowd: -Strong oral & written communication skill (both English and Chinese). -Development experiences in datacenter design or server product. -Self-motivated and aggressive to learn

工作內容: 硬體設計 基本迴路構成設計 方案及主要零件選擇 工程樣品 及 零件表製作 及試作 與配合工廠協調 共同設計開發 產品性能測試及測試報告撰寫 規格確認 驗證除錯 規格書及日程管理 EMI, ESD, EMC, 認證測試 跨部門（軟體、品保 QC/QA、生產）協作，完成產品技術轉移並導入量產 RMA 分析對應 協助主管完成時程內交辦事項 主要使用電子郵件和SNS（TEAMS 、WECHAT）與日本總公司以英語溝通. Experienced in designing, developing and evaluating CPU boards. Video related professional design split or experience. Maintaining MOSFET circuit design skills Hardware-Circuit design with more than 7 years of mass production start-up experience. Overseas customer business management & communication experience. A person who is interested not only in the development of computer equipment but also in the development of products that apply electrical technology in other fields. 必要經歷： 影像相關產品 硬體開發 設計迴路 組裝製品 Linux / android 軟體搭配 嵌入式產品設計 多層PCB設計 IOT 物聯網 微處理器等相關產品開發 對開發新產品有興趣者 CPU board system design experience Future: Those who are not related to computers but are willing to take on the challenge of developing home appliances.

1.Embedded System 等網路通訊硬體系統整合開發設計。 2.設計項目涵蓋相關AP等產品。 3.電路設計，選擇最佳零件，PCB佈線指導概念，電路除錯及訊號量測等。