「Product Application Engineer (High Speed Backplane)」的相似工作

1.每月都會有出差至中南部,要能配合過夜出差,時長不一定,每週可能三天也可能到五天。 2.出差另有過夜及路程津貼,中南部備有公司宿社。 3.初期會先留桃園廠內學習機台組裝。 3.經常性的要配合台積電、日月光等科技大廠巡檢設備維修保養，或至客戶端進行檢查維修及保養本公司產品壓濾機。 4.俱有電機、水電、機械相關專長為佳;無經驗亦可。 5.具有手排自小客車駕照並且有實際上路經驗。 6.每月需一個周六上班(假日加班計,全公司統一上班日)。 7.到職滿三個月會考核調薪;到職滿一年考核調;滿一年以上員工每年除年終獎金外,會有三次績效考核獎金發放.

The Product Design Engineer for overpass solutions is mainly focusing on developing high speed cable solutions for front IO, near chip and Co-package chip applications. This position will highly engage with customer in early design stage, providing technical expertise on mechanical, cable route, and application hardware. Role and Responsibilities - Work closely with customer and their contract manufacturers to understand their design requirements, evaluate the challenging, and provide full workable interconnection solutions including connector interference, connector fitting structural, cable management, and application hardware. - Mechanical design and concepting in 3D model:  Front IO cage overpass solution.  Custom design for cage mechanism.  Work with thermal engineer to optimize thermal solution for customer.  Near chip overpass solutions:  Provide technical guidance to customer on product selection.  Design for different pairs configuration, connector fitting mechanism, cable output and management, and application hardware if needed.  Co-package copper overpass solutions:  Work with customer to complete the design that our connector can fit into customer’s package, including optimize connector layout in substrate, alignment feature and fitting mechanism, application hardware. - Verify if the design if it meets design objectives by varies engineering tools such as tolerance analysis, FEA, failure mode effect analysis… - Create complete cable assembly drawing including two ends solutions, wiring chart, cable pre-bending geometry(if needed). - Work with cross function team(mechanical, signal integrity, manufacturing) to ensure the design can be transited to mass production. - Create test plan and strategy for product in NPI status to verify the reliability, robustness in application before shipment.

The Hardware Test Engineer provides crucial hands-on technical support for production test systems. This role is responsible for independent execution of issue triage and in-depth troubleshooting of production fallouts. This engineer will also actively contribute to yield improvement initiatives and assist with the development, validation, and maintenance of tester stations and fixtures. Minimum Qualifications: ● BS or MS degree in Electrical Engineering, Electronics Engineering, or a related field. ●0-1 years of practical experience in electronic manufacturing or related hardware testing environments. ● Proficiency in digital and analog circuit analysis, PCBA bring-up, and systematic troubleshooting of test failures. ● Solid command of EE lab instruments (e.g., oscilloscopes, DMMs, power supplies) and proven ability to apply these skills to solve production problems. ● Demonstrated ability to work independently on assigned tasks and communicate technical findings clearly. Preferred Qualifications: ● Foundational experience with PCBA and module failure analysis (FA) techniques. ● Familiarity with production data analysis and simple process improvement methodologies. ● Experience with Linux operating systems in a testing or manufacturing environment. Responsibilities: ● Execute and own the PCBA and module troubleshooting, bring-up, and rework processes from start to finish. ● Maintain and update product troubleshooting procedures and guides as needed. ● Analyze failure data to provide detailed failure analysis findings and clear root cause hypotheses to the test development team. ● Serve as the primary on-site technical contact for manufacturing partners, rapidly triaging production line issues and driving immediate containment actions. ● Collaborate with cross-functional teams (e.g., HW Design, Manufacturing) to ensure test integrity and high product yield.

• Interact / Interface w/Amphenol Commercial and High-Speed BU teams on material supply, buffer inventory, manage aging inventory, etc. requirements. • Interface/communicate via e-mails, F2F, phone conversations with key account customer on expedites, COS, part number shipment details, RFQ activities. • Integrate with Sales and BU Product Managers on key Design opportunities. • Integration w/Direct and ODM account teams on key metrics that will deliver growth. • Develop a successful Business Continuity Plan. • Integrate with all BUs to develop an annual cost down plan. • Support Business Management Meetings (QBR), and strategic annual business plans. • Integration with all Bus on key metrics • Market share monitor w/BU and Sales team • Align businesses to deliver customer forecasts. • Integrate and manage PCNs internally and externally w/customers • Manage customers’ Key Initiatives by working with Sales/FAE and BU’s. • Integrate with Amphenol’s BU team to support RBA, Resilinc, plant quals., etc

【工作內容】 1. 系統規劃與設計 - 協助專案從前期評估到建置完成，提供完整機電工程技術支持。 - 依據場域條件與需求，進行儲能系統、微電網規劃（容量規模、PCS、BMS、EMS 架構）。 - 能繪製、修改電力單線圖、土建/機電平面配置與竣工圖，並確保與現場電力設備（TR、開關櫃、儲能、太陽能系統）介接。 - 具備基礎通訊協定了解（如 Modbus、IEC 61850 等) ，熟悉網路架構能並能依場域需求規劃儲能系統網路架構並能與客戶討論。 - 需要積極主動，願學習新事物的態度及負責要求的工作原則。 2. 監造與現場支援 - 監督儲能系統施工進度與品質，確保依設計圖面與規範執行。 - 檢視施工狀況，確認符合建築、電力、儲能等安全規範。 - 協調分包廠商施工與現場配合，提供技術指導，並追蹤異常問題。 - 具備現場施工監造、測試與問題排解經驗。 - 具備大型儲能專案執行管理的經驗 3. 安裝與驗收 - 支援現場安裝與並將公司的產品導入案場並設定完成 - 依據客戶需求與相關法規，檢驗系統效能與安全性，確保符合驗收標準與合約規範。 - 完成施工紀錄、測試報告與技術文件，提供驗收依據並支持後續維運。 【專業技能】 - 熟悉任何一個電腦製圖工具，ex : AutoCAD、SolidWorks、CATIA、或其他繪圖軟體 - 熟悉儲能系統架構（PCS、BMS、EMS、變壓器、SCADA）。 - 具電力系統分析能力（潮流分析、短路計算佳）。 - 熟悉儲能 / 微電網應用的基本知識（需量反應、調頻、削峰填谷、自用轉供）。 【加分項目】 - 熟悉再生能源與儲能相關法規（台電並網規範、消防規範、再生能源條例） - 具有機電品管工程師、勞安證照、工地主任經驗尤佳。

1.Support Design Engineer on Signal Integrity testing and Debugging on Chip and Demo Board 2.Support Customer projects design-in stage to mass-production. 3.Support Customer projects design review (Schematics, layout, CTS report) 4.Team work with RD, AE and QA on debugging and problems solve.

1. PCB 設計（含原理圖設計、佈局佈線、Gerber 輸出）。 2. 客戶服務(PCIe/USB3相關) - 協助客戶釐清技術問題並提供可行解決方案。 - 參與客戶專案評估與設計審查（Design Review，含原理圖與佈局）並提出建議。 - 協助客戶進行產品特性分析與測試驗證。 3. 具跨部門協作與專案支援能力。 作為硬體研發工程師，您將成為我們團隊中關鍵的成員之一。您的工作將有助於產品的開發和改善，確保我們的產品能夠達到高標準的品質和性能。此職位的發展前景良好，並提供豐富的學習和專業成長機會。 如果您符合我們的要求並對此職位感興趣，請盡快申請並表達您的興趣。我們期待能夠與您共事，一起實現更好的產品和更大的成功。

工作內容： 1. 熟悉工業自動化相關產品售後. 2. 熟悉電控, 測試, 產品電路圖知識 3. 用戶現場工控產品更換, 復機 4. 工控產品PCBA level 板件更換 5. 了解售後服務流程 6. 客端工程人員應對, 與問題答覆 7. 參加GTM/GTC流程, 承接新產品售後服務內容規劃 8. 測試製具設計, 發包, 優化 9. 升任國內外產品售後服務培訓講師 工作技能： 技術諮詢與服務;客戶端技術服務業務;運用Auto CAD與Pro-E程式;產品分析及追蹤不良品改善;檢查及檢驗報告結果判讀;流程管理;顧客關係管理;重點客戶管理;客訴/客退要因解析

- Product development and promotion - Manage the program launch - Cost, pricing and margin management - Capacity planning management - Closely collaborate with customers, development/design/production team

1.高速訊號應用趨勢研究 2.新材料驗證與測試 3.電性design rule建立 4.Technology roadmap建立 5.高速訊號設計專利資料收集&研究 6.客戶高速訊號應用對應與回饋

1. 協助客戶問題釐清及解決, 處理客戶訴願 2. 協助業務推展 3. USB/SATA/PCIe/Ethernet/Serdes電器特性量測

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

1.Research and study of new specifications/standards of SSD products. 2.Products introduction and promotion to customers. 3.Failure Analysis and providing solutions. 4.Assisting in controller/SOC vendors firmware building. 5.Projects management and tracking. 6.New projects/customers approach and development.

1. 良率數據分析及報告撰寫 2. 不良缺陷分析(顯微鏡、SEM/EDX、FTIR) 3. 專案改善規劃及執行 4. 客訴分析及改善 5. 新製程、材料開發及驗證 6. 跨單位溝通合作 薪資及職稱依學經歷調整

SSD Hardware Design and Verification: Job responsibilities: SSD HW SI/PI/EMC design and verification quality assurance. 1.SSD HW circuit and PCBA board level design and assembly. 2.Component-level selection and verification. 3. Driver-level SI/PI/EMC design and verification. 4. System-level compliance verification.

我們提供的挑戰與機會 • 參與公司最前沿的 AI 伺服器與高效能運算平台設計，影響新一代資料中心的核心產品。 • 研究新技術與產業趨勢，從需求評估到系統方案定義，直接影響全新架構專案的走向。 • 負責跨模組設計整合（Compute、Networking、Thermal、Power、Mechanical），確保系統設計可行並能成功落地。 • 直接參與與國內外客戶的架構討論，影響產品 roadmap 與技術策略。 工作職責 1. 前期評估公司收到的新專案規格，釐清技術需求並進行可行性分析。 2. 主導系統架構規劃，定義模組分工與介面 (compute board, GPU, switch, power, cooling)。 3. 研究與引入新技術 (如液冷、CPO/光互連、800V HVDC 等)，提出系統解決方案。 4. 跨部門協作，確保 EE、ME、Thermal 與 FW 設計符合整體架構要求。 5. 協助客戶進行技術方案評估與設計 review，並提供決策建議。 職涯亮點 • 參與全新架構專案，從需求到量產全程影響產品決策。 • 接觸並應用最新前沿技術，提升系統架構與整合能力。 • 建立跨國專案經驗，累積系統工程與架構規劃的職涯競爭力。

Hardware Engineer will work with Product Owner, Software team, NPI team and Contract Manufacturer for being the focal point of delivering hardware solution and product design per request, both internal and external. Responsibilities • Design hardware solution (System of Systems) to fulfill company's goal • Owns EE design of the rugged products based on ARM or x86 - Create and maintain OrCAD schematic - Create layout guide and work with layout house - Guide rest of team through PCB fab's EQ process • Work with Mechanical Engineers and NPI Process Engineers for DFM • Create and maintain debugging procedures

1.類比訊號分析及電路設計。 2.小信號低雜訊放大線路的設計、模擬、量測及驗證。 3.熟悉OPAMP, Filter, ADC/DAC,… 規格, 性能特性及應用。 4.電子電路硬體的設計、驗證，失效分析和故障排除 5.萬潤熱烈招募有意投入設備產業的菁英，如未具備本項職缺所需相關技能與工作資歷者 亦歡迎投遞，薪資另議。 6.上班地點 新竹：新竹市工業東四路24-2號2樓 /新竹縣竹北市保泰三路 78 號 台中：台中市西屯區工業區37路18號 高雄：高雄市路竹區路科十路1號

我們正在尋找一位熱情、有經驗的EDA應用工程師，加入我們充滿創新和技術挑戰的團隊。這位工程師將與台灣地區的客戶及合作夥伴緊密合作，提供最新的電子設計自動化工具和技術支援，以實現客戶的設計最佳化及效率提升。 職責： 與客戶端的工程師密切合作，了解其設計需求，提供EDA工具相關的技術支援。 協助客戶優化和自動化設計流程，以提高生產力和效率。 在EDA工具中執行模擬和分析，確保客戶設計的性能、功耗和可靠性符合要求。 解決客戶在設計過程中遇到的技術挑戰，提供解決方案以滿足其產品開發目標。 資格要求： 學士或以上學歷，專業領域包括電子工程、計算機工程或相關領域。 具備良好的問題解決和溝通能力，能夠有效協作並在客戶團隊中發揮領導力。 對IC設計、半導體及EDA產業有濃厚興趣，並追求不斷學習和專業成長。 必要條件： 具有相關EDA工具（如Cadence、Synopsys、Mentor Graphics等）的使用經驗。 熟悉硬體描述語言（SystemVerilog、Verilog、VHDL）和模擬工具。 英文聽說讀寫中等以上

1.產品設計：根據需求設計產品、繪製圖面與選用物料。 2.性能驗證：產品測試、分析與改善。 3.製程改善：開發製程改善所需的治具與產品設計變更。 4.其他主管交辦之相關工作任務。

## Job Description: - Planning and establishing pass/fail criteria for LEO satellite product testing (e.g., OTA, Thermal Vacuum, Radiation, etc.). - Execution and result analysis of LEO satellite product testing. - Writing test reports and documenting anomalies - Developing and maintaining automated testing programs to improve testing efficiency. ## Skill: - Familiarity with RF or phased array testing is preferred. - Familiarity with Python and basic instrument control is preferred. - Familiarity with military and space testing standards is preferred.