「Product Application Engineer (High Speed Backplane)」的相似工作

Our customer’s success depends on our ability to solve their design challenges and provide interconnect solutions. We value our relationships with these companies and depend on our Field Application Engineers – FAE, to foster this ongoing technical partnership. As an Field Application Engineer, you will engage with the design teams at our key customers to provide technical expertise and solutions to meet their needs. This position combines design, engineering knowledge, and business techniques to drive the growth strategy. • Provide world class technical support to our customers (engineer to engineer) • Build technical relationships with our customer’s engineering teams • Engage customers early in design stage to achieve design win • Understand customers technical requirements and create concepts to solve customer’s interconnect challenges. • Differentiate our products and services above our competitors. • Provide design guidance to customers on innovative interconnect applications against their design requirements. • Understand our customers technical roadmaps to co-work with various business unit development activities to customer needs. • Some travel will be required to meet with customers within different China region.

【工作內容】 1. 系統規劃與設計 - 協助專案從前期評估到建置完成，提供完整機電工程技術支持。 - 依據場域條件與需求，進行儲能系統、微電網規劃（容量規模、PCS、BMS、EMS 架構）。 - 能繪製、修改電力單線圖、土建/機電平面配置與竣工圖，並確保與現場電力設備（TR、開關櫃、儲能、太陽能系統）介接。 - 具備基礎通訊協定了解（如 Modbus、IEC 61850 等) ，熟悉網路架構能並能依場域需求規劃儲能系統網路架構並能與客戶討論。 - 需要積極主動，願學習新事物的態度及負責要求的工作原則。 2. 監造與現場支援 - 監督儲能系統施工進度與品質，確保依設計圖面與規範執行。 - 檢視施工狀況，確認符合建築、電力、儲能等安全規範。 - 協調分包廠商施工與現場配合，提供技術指導，並追蹤異常問題。 - 具備現場施工監造、測試與問題排解經驗。 - 具備大型儲能專案執行管理的經驗 3. 安裝與驗收 - 支援現場安裝與並將公司的產品導入案場並設定完成 - 依據客戶需求與相關法規，檢驗系統效能與安全性，確保符合驗收標準與合約規範。 - 完成施工紀錄、測試報告與技術文件，提供驗收依據並支持後續維運。 【專業技能】 - 熟悉任何一個電腦製圖工具，ex : AutoCAD、SolidWorks、CATIA、或其他繪圖軟體 - 熟悉儲能系統架構（PCS、BMS、EMS、變壓器、SCADA）。 - 具電力系統分析能力（潮流分析、短路計算佳）。 - 熟悉儲能 / 微電網應用的基本知識（需量反應、調頻、削峰填谷、自用轉供）。 【加分項目】 - 熟悉再生能源與儲能相關法規（台電並網規範、消防規範、再生能源條例） - 具有機電品管工程師、勞安證照、工地主任經驗尤佳。

• Interact / Interface w/Amphenol Commercial and High-Speed BU teams on material supply, buffer inventory, manage aging inventory, etc. requirements. • Interface/communicate via e-mails, F2F, phone conversations with key account customer on expedites, COS, part number shipment details, RFQ activities. • Integrate with Sales and BU Product Managers on key Design opportunities. • Integration w/Direct and ODM account teams on key metrics that will deliver growth. • Develop a successful Business Continuity Plan. • Integrate with all BUs to develop an annual cost down plan. • Support Business Management Meetings (QBR), and strategic annual business plans. • Integration with all Bus on key metrics • Market share monitor w/BU and Sales team • Align businesses to deliver customer forecasts. • Integrate and manage PCNs internally and externally w/customers • Manage customers’ Key Initiatives by working with Sales/FAE and BU’s. • Integrate with Amphenol’s BU team to support RBA, Resilinc, plant quals., etc

1. Mechanical design of servers and high-density storage devices, tolerance analysis, quality and cost control, vibration and thermal solutions, assembly optimization, cable routing. 2. Responsible for RFQ evaluation, product design, mold development review, and maintenance through mass production. 3. Work with vendor on tooling issue. 4. Provide 2D, 3D and BOM created. 5. Provide DXF for Layout placement

工作需求 (Job Requirements) 1.電子相關科系大學或碩士以上 2.2-5年的SI(訊號完整性)設計相關工作經驗 3.熟悉相關SI模擬軟體工具相關經驗 4.需與亞洲不同地區的辦公室協助合作 5.能獨立完成公司交辦的工作 工作職責 (Job Responsibilities) 1.負責3D高頻模擬軟體之售前拜訪、技術支持、產品培訓及專業規劃與執行。 2.熟悉PCB、SI信號完整性等相關模擬經驗 3.負責3D軟體的應用及技術支持給現有與新的潛力客戶 4.負責準時完成主管分配的工作

1. PCB 設計（含原理圖設計、佈局佈線、Gerber 輸出）。 2. 客戶服務(PCIe/USB3相關) - 協助客戶釐清技術問題並提供可行解決方案。 - 參與客戶專案評估與設計審查（Design Review，含原理圖與佈局）並提出建議。 - 協助客戶進行產品特性分析與測試驗證。 3. 具跨部門協作與專案支援能力。 作為硬體研發工程師，您將成為我們團隊中關鍵的成員之一。您的工作將有助於產品的開發和改善，確保我們的產品能夠達到高標準的品質和性能。此職位的發展前景良好，並提供豐富的學習和專業成長機會。 如果您符合我們的要求並對此職位感興趣，請盡快申請並表達您的興趣。我們期待能夠與您共事，一起實現更好的產品和更大的成功。

The Hardware Test Engineer provides crucial hands-on technical support for production test systems. This role is responsible for independent execution of issue triage and in-depth troubleshooting of production fallouts. This engineer will also actively contribute to yield improvement initiatives and assist with the development, validation, and maintenance of tester stations and fixtures. Minimum Qualifications: ● BS or MS degree in Electrical Engineering, Electronics Engineering, or a related field. ●0-1 years of practical experience in electronic manufacturing or related hardware testing environments. ● Proficiency in digital and analog circuit analysis, PCBA bring-up, and systematic troubleshooting of test failures. ● Solid command of EE lab instruments (e.g., oscilloscopes, DMMs, power supplies) and proven ability to apply these skills to solve production problems. ● Demonstrated ability to work independently on assigned tasks and communicate technical findings clearly. Preferred Qualifications: ● Foundational experience with PCBA and module failure analysis (FA) techniques. ● Familiarity with production data analysis and simple process improvement methodologies. ● Experience with Linux operating systems in a testing or manufacturing environment. Responsibilities: ● Execute and own the PCBA and module troubleshooting, bring-up, and rework processes from start to finish. ● Maintain and update product troubleshooting procedures and guides as needed. ● Analyze failure data to provide detailed failure analysis findings and clear root cause hypotheses to the test development team. ● Serve as the primary on-site technical contact for manufacturing partners, rapidly triaging production line issues and driving immediate containment actions. ● Collaborate with cross-functional teams (e.g., HW Design, Manufacturing) to ensure test integrity and high product yield.

1. 協助客戶問題釐清及解決, 處理客戶訴願 2. 協助業務推展 3. USB/SATA/PCIe/Ethernet/Serdes電器特性量測

I. JOB SUMMARY Hardware DQA/EA Engineer II. PRINCIPAL DUTIES AND RESPONSIBILITIES • Debugging with HW/FW team to clarify issue. • High/Low speed signal test plan/report create & review. • Analysis high speed design ability. • Familiar with signal validation equipment/tools and specification. • Familiar with High/Low speed signal measurement ex. PCIe, SATA, SAS, USB, IEEE, I2C, SPI, RGMII...etc. • Familiar with Intel/AMD Margin test tools.

1) IoT物聯網、居家安全控制系統、印表機相關等消費性電子產品硬體開發 2) 電子電路線路設計與 Layout 確認 3) 電子硬體除錯、功能整合與驗證 4) 產品工程文件建立與維護 5) 新產品導入試產及量產與異常問題分析解決

1. 熟悉GPU顯示卡設計 2. 熟悉ARM based (NXP、Rockchip、TI、Qualcomm..等) 硬體設計 3. 電子電路設計(OrCAD Capture & Allegro) 4. 整合系統設計架構及主板除錯

1.高速訊號應用趨勢研究 2.新材料驗證與測試 3.電性design rule建立 4.Technology roadmap建立 5.高速訊號設計專利資料收集&研究 6.客戶高速訊號應用對應與回饋

1.Analog and mixed mode circuit layout and verification 2.Co-work with designer for layout floor planning,routing and physical verifications 3.command file maintain

Hardware Engineer will work with Product Owner, Software team, NPI team and Contract Manufacturer for being the focal point of delivering hardware solution and product design per request, both internal and external. Responsibilities • Design hardware solution (System of Systems) to fulfill company's goal • Owns EE design of the rugged products based on ARM or x86 - Create and maintain OrCAD schematic - Create layout guide and work with layout house - Guide rest of team through PCB fab's EQ process • Work with Mechanical Engineers and NPI Process Engineers for DFM • Create and maintain debugging procedures

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之硬體電路設計。 2. 熟悉RF PCB Layout Guideline與PCBA廠商管理。 3. 理解SI/PI的觀念。

【產品線說明】 IT裝置(Notebook, Monitor..)顯示觸控整合產品 【工作內容】 1. Touch技術、專利研究與平台建置 2. Touch系統與硬體規格制訂 3. FPGA與IC驗證 4. IC訊號分析與ISSUE排除 【必要條件】 1. FPGA/PCB/FPC電路設計經驗 2.具通訊/影像處理/DSP 開發經驗 3. 具Matlab / Python ...程式開發經驗

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

我們提供的挑戰與機會 • 參與公司最前沿的 AI 伺服器與高效能運算平台設計，影響新一代資料中心的核心產品。 • 研究新技術與產業趨勢，從需求評估到系統方案定義，直接影響全新架構專案的走向。 • 負責跨模組設計整合（Compute、Networking、Thermal、Power、Mechanical），確保系統設計可行並能成功落地。 • 直接參與與國內外客戶的架構討論，影響產品 roadmap 與技術策略。 工作職責 1. 前期評估公司收到的新專案規格，釐清技術需求並進行可行性分析。 2. 主導系統架構規劃，定義模組分工與介面 (compute board, GPU, switch, power, cooling)。 3. 研究與引入新技術 (如液冷、CPO/光互連、800V HVDC 等)，提出系統解決方案。 4. 跨部門協作，確保 EE、ME、Thermal 與 FW 設計符合整體架構要求。 5. 協助客戶進行技術方案評估與設計 review，並提供決策建議。 職涯亮點 • 參與全新架構專案，從需求到量產全程影響產品決策。 • 接觸並應用最新前沿技術，提升系統架構與整合能力。 • 建立跨國專案經驗，累積系統工程與架構規劃的職涯競爭力。

※ 需熟示波器、邏輯分析儀、訊號產生器等基礎儀器之使用 1. Familiar with Touch IC is a plus, provides technical expertise and value to customers. 2. Responsible for understanding the customer's application requirement and works with sales and marketing to provide the product that meets customer s need. 3. Provide technical support for products and work with SW and FW to identify customer's issues. 4. 有PC硬體背景佳(示波器、I2C通訊、量測訊號).