「Sr. System Hardware Design Engineer 」的相似工作

The successful candidate will be a self-starter who likes to take responsibility and works best with little supervision. Likes to perform a variety of tasks and have the ability to handle multiple priorities and has previously performed in a similar position. This is a 'hands-on' role requiring a strong technical background and product development experience. Duties: • Identify technical issues, troubleshoot and resolve them by coordinating with R&D, Manufacturing and Field teams. • Participate in customer technical meetings and prepare training programs for internal subordinates. • Hardware validation of Networking, Storage, Server products against customer's infield issues, requirements and Mfg. issues during NPI or RMA. • System validation including DVT (Design Validation Trial), SPIT (Signal, Power, Integrity & Timing) environmental & regulatory approval. • Qualify alternative components for compatibility, cost effectiveness and benchmarking. • Support Manufacturing Engineering and Test Engineers on trouble shooting and resolving technical issues and root cause analysis. • Work with software teams to identify root cause of system failure. • Ability to install software such as Linux based Operating Systems, ONIE, BIOS, BMC, SES. • Proficient in using various test and measurement equipment including but not limited to Oscilloscope, Impedance analyzer, Power meter, Signal analyzer, Spectrum. Background: Candidates should have 8+ years' experience in either Network, Storage or Server products. Candidates should have the following essential qualifications and experience: • At least BEng. (Hons.) in Electronics or similar. • Strong electrical design and debug skills required. • Familiar with PCIe, NVMe, SAS, SATA, I2C, SPI, DDR buses. • SDRAM timing and integrity analysis for clocks, strobes, S&H, Power bounce, temp stability. • Hands-on design knowledge of latest peripheral chipsets for Gigabit Ethernet, SCSI, SATA, SAS, USB, Ethernet, & PCI cards etc. • High performance RISC / X86 CPUs and architecture including Intel, AMD, MRVL. • Proficient in using various test and measurement equipment including but not limited to Oscilloscope, Impedance analyzer, Power meter, Signal analyzer, Spectrum analyzer. • Qualify alternative components for compatibility, cost effectiveness and benchmarking. • System validation including DVT (Design Validation Trial), SPIT (Signal, Power, Integrity & Timing) environmental & regulatory approval. • Work with software teams to identify root cause of system failure. • Working knowledge of windows & Linux configuration, installation procedure, network configuration, driver configuration etc. • Working knowledge of Diag, ONIE, BIOS, BMC, Linux and Windows operating systems • Knowledge of the following would be desirable: - Experience of working in medium sized multidisciplinary development teams - Ethernet Switches, Server, Storage products - Orcad Schematics & Allegro PCB layout tools Personal Attributes: The successful candidate will be a self-motivated individual capable of working with a minimum level of supervision in a dynamic team environment. Good interpersonal skills. Be able to communicate effectively (both verbal and written) with members of other teams, departments and clients; a high degree of liaison is needed.

1.需具備10年以上半導體封裝或電子元器件封裝領域從業經歷，熟悉封裝全流程技術細節，包括但不限於引線鍵合、倒裝焊、晶圓級封裝、系統級封裝（SiP）、功率器件封裝等主流工藝，瞭解不同封裝形式的技術特點與應用場景，全新產品開發（製圖、框架設計、耗材新開發、全新封裝設備評估、無到有） 2.需擁有 10年以上研發團隊管理經驗，曾帶領 20人以上 RD 團隊開展工作，具備團隊組建、人才梯隊建設能力，能根據專案需求合理分配人力，制定清晰的團隊發展規劃，培養核心技術骨幹。 3.熟悉研發專案管理方法論，能主導從專案立項、需求拆解、方案評審到測試驗證、量產交付的全流程推進，具備跨部門協作能力（如與生產、採購、品質部門對接），確保研發目標按時達成。

Job Summary: 1. We are looking for a highly skilled and experienced Senior Hardware Design Engineer to join our server development team in Taipei. 2. The ideal candidate will be responsible for high-speed hardware design, schematic capture, debugging, and working cross-functionally with layout, validation, firmware, and manufacturing teams to deliver high-quality server products and add-on cards. Key Responsibilities: 1. Responsible for schematic capture, layout review, BOM generation, and debugging/testing of server motherboards and add-on cards. 2. Collaborate with layout engineers, BIOS and firmware engineers, validation and test engineers, and cross-functional teams to identify and resolve engineering issues early in the development cycle. 3. Participate in and contribute to design reviews, architecture discussions, and project planning. 4. Prepare and maintain technical documentation, including product specifications, layout guidelines, test procedures, and design review reports. 5. Ensure product compliance with engineering specifications, safety, and energy regulations if any (e.g., ErP), and customer performance expectations. 6. Provide clear documentation and technical support to contract manufacturers and production teams during prototype and mass production stages. 7. Lead root cause analysis and provide corrective actions for hardware-related production or field issues. Required Qualifications: 1. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 2. Minimum 5 years of experience in hardware design for server, PC, or embedded systems. 3. Proficient in schematic capture tools (e.g., OrCAD). 4. Solid understanding of high-speed signal integrity, power delivery design, and board-level debugging. 5. Hands-on experience with lab equipment such as scopes, logic analyzers, and multimeters. 6. Strong problem-solving and analytical skills. 7. Good communication and documentation skills in both English and Mandarin.

1. 能夠了解主板的線路及其動作方式與原理並獨立完成設計。 2. 硬體設計問題的初步分析與解決。 3. 負責線路的Net list check 並確認其正確性。 4. 負責產品的方案制定、器件選型、硬體設計、調試等工作 。 5. 編寫產品BOM、生產指導文件等技術資料 。

Molex possesses a rich heritage in the optical industry. We provide the highest performing and field-proven wavelength management solutions from components, modules to integrated line-cards. Continuous innovation in passive component function integration, miniaturization, and manufacturing automation, cutting edge WSS and amplification technology and comprehensive optical, mechanical, electrical and software design capabilities enable us to serve the needs of high-density, high-bandwidth, and flexible optical networks of telecom, datacom, hyperscale datacenter, artificial intelligence, and supercomputing. In New Taipei, Taiwan, we serve global clients in telecom and datacom industries in providing next generation optical modules to support 5G Networks. We are looking for a Senior Electrical Design Engineer. We are building a new capability to accelerate our leading edge optical networking capabilities. We are looking for a Senior Engineer that will design, review, and improve a variety of optical equipment, including OTDR, OCM, OSC and other electronic products for 5G and other advanced optical networking systems and data communications networks. Responsibilities: • Develop, review, release, and support advanced optical modules and sub-systems such as OTDR, OSC, OCM, etc. • Work with product marketing and engineering team consisting of optical, hardware, mechanical, software, and process engineers to enable high performance, cost effective, and robust products, and repeatable and efficient manufacturing • Ensure successful transition from architecture to new product introduction and to volume production • Drive and recommend innovative solutions to ensure product meets customer performance, cost, schedule, and other requirements • Select components, generate schematic design, create PCB layout instructions, and closely work with FPGA, software, mechanical, thermal, optical, process and other teams to optimize the design • Perform circuit simulation for high speed signals using HFSS, ADS, or similar • Complete board bring-up, debug and validate performance of electronic systems; conduct experiments to characterize components and subsystems • Generate documentation of the design and results of the experiments and testing • Help develop DVT, manufacturing, assembly, diagnostic, test, qualification plans and other documents. Provide technical guidance to resolve manufacturing issues • Resolve customer technical issues. Work with FAE, QA, and other technical-support teams • Work with global teams for new product designs • Perform other duties as assigned by management Requirements: • Bachelors degree in Electrical Engineering • At least 8 years electrical engineering experience in Telecom, Datacom industry or related fields • Proficient in designing high speed boards • High speed digital transmission and signal integrity knowledge • Proficient with electronic design and simulation tools, such as OrCAD with CIS, Allegro, HFSS What will put you ahead • Masters of Electrical Engineering • Experience EDFA and Raman optical amplifiers • Experience in designing and resolving ESD, EMI, Immunity and other compliance and safety related items • Proficient in analog electronics: TIA, PD, filters, ADC, DAC, analog PLLs, etc.

Has lead experience for X86 or GPU system. 1. 獨立(或領導一個團隊)負責伺服器(Server)產品之電子電路設計與開發 2. 能進行新技術/概念/晶片世代的研究並透過新案子實踐並提供符合(或超越)市場需要之產品設計 3. 審查設計及驗證之相關文件(Schematic/Layout/Validation Repot/Issue-analysis Report/Product specification…etc.) 4. 產品除錯及問題排除 5. 在不影響產品品質的前提下, 有效率執行設計研發流程; 並將價格(cost)和品質(quality)兩者都放進設計考慮中. 6. 能同時執行多個專案目標並成功完成 7. 能推動跨組織討論,有效率解決技術問題,並主持與客人之技術討論 8. 協助引領團隊並協助其他成員解決問題

我們是 EGNAS，專注於打造嵌入式數位儀錶的技術型公司，結合 Linux 系統、高效能硬體與車規設計，為商用車與特殊車輛提供可靠的解決方案。前代產品已成功導入多款車型並投入實際量產，現正邁入新一代數位儀錶的開發關鍵期。 如果你熱愛智慧移動工具，對電動車、自行車、重機或工業車輛的技術充滿熱情，並擁有電子電路設計與量產導入經驗，歡迎加入我們的核心研發團隊，共同打造從零開始、實際落地的產品！ 【主要工作內容】 負責嵌入式數位儀錶的電路設計、驗證與量產導入，工作範圍涵蓋從產品研發初期的設計到後期生產落地，包括： 【嵌入式硬體架構設計與整合】 ・具備 MCU / MPU 系統架構理解，熟悉嵌入式應用電路設計・熟悉車用電子設計規範（如：安規認證、EMC／EMI 解決方案）尤佳 【電路設計與 PCB 佈局整合】 ・使用 Altium Designer、OrCAD、Allegro 等工具進行電路圖設計 ・進行 layout review、多層板設計、高速訊號線佈局 ・建立並管理 BOM 表，配合產品結構整合需求 【硬體電路驗證與測試】 ・執行 Power / Signal Integrity / 功能驗證等測試 ・能進行手焊件作業，熟悉基本儀器操作（如三用電錶、示波器、函數產生器） ・具備設計基礎測試設備（如測試治具、測試台）能力尤佳 【跨部門與對外協作】 ・與軟體、PM、工業設計、機構設計與外部協力廠合作，整合電子零件規格、廠牌型號與成本考量 【產品維護與量產支援】 ・協助工廠樣品打樣與量產導入，處理產測問題 ・維護與優化既有產品電路設計，處理生產端突發狀況並提升良率 【文件撰寫與技術傳承】 ・撰寫設計與測試相關技術文件、維修手冊、操作說明等 本職務將直接參與公司核心產品的硬體設計與落地過程，橫跨嵌入式電路設計、測試驗證、量產整合與跨部門協作等多個環節。你將不只是做設計，而是能全程參與一個產品從無到有、從樣品到量產的技術實現之旅。這份工作非常適合希望技術能力持續深化、對最終產品品質與完整研發過程有責任感的工程師。 我們提供 保障年薪制度、彈性信任的工作環境，以及與核心技術團隊共事的成長機會。期待有志之士與我們一同推動智慧移動領域的創新與實現。

IoT Smart Home產品專案之硬體研發，產品類別包含IP Camera、Sensor、Tracker等： 1. 負責線路設計與功能測試，並與相關單位合作進行Layout規劃、基頻驗證與除錯、RF訊號驗證優化，以及EMC/EMI測試。 2. 規劃電子電路與電源、熟悉元件特性及零件選用。 3. 專案開發期間須短暫至工廠協助試產，分析、解決製造與相關測試單位的問題。

因應全球AI應用的發展，公司業務持續成長中，宜鼎國際正在尋找ARM 硬體研發工程師加入我們的團隊！ 我們致力於服務我們的顧客與合作夥伴，鼓勵面對面的互動和團隊合作。如果您擁有相關經驗，並對科技產業充滿熱情，誠摯地邀請您加入我們優秀的團隊，親身體驗我們充滿活力的公司文化。 【工作地點】 此職位的辦公室設在交通便利的新北市汐止，距離 捷運南港展覽館站 或 汐止/汐科火車站 或 交流道 僅3-10分鐘車程，大樓就有停車位、Youbike及豐富的公車選擇，讓您的通勤更加便捷。 辦公大樓過個馬路就到好市多Costco，中午或下班採買日用品超方便，使您的工作和生活更加平衡。 【主要職責】 1. Qualcomm/NXP電路設計與驗證 2. Layout Placement Review and Layout Check 3. 協助生產單位導入量產測試 4. 協助不良產品分析 【我們提供什麼】 在全球AI解決方案與工業級儲存領導品牌的公司中實現自我！ 在「一群夥伴、一同經營」核心精神中，積極經營自有品牌，與公司一同成長，共享豐厚的發展機會和福利！ 加入宜鼎國際，一起寫下值得回憶的故事！

1. Circuit Design(OrCAD) 2. Layout Review(Allegro) 3. HW Validation and Trouble Shooting 4. BOM Maintenance and P/N Application 5. New Technology Study and Introduction 6. Design Proposal Integration 7. Schedule Control 8. Cross-sectional Collaboration

1.負責車用 ECU 產品的硬體系統架構設計、原理圖繪製與 PCB layout 規劃。 2.開發基於Renesas、NXP車用 SoC的ECU。 3.設計與驗證高速訊號，如 DDR4/5、SerDes、PCIe、Ethernet、LVDS。 4.建構 8~12 層 HDI PCB、盲/埋孔設計、stacked via 結構與 EMC/EMI/ /ESD對策。 5.協助系統 bring-up、功能測試、信號完整性分析與熱分析。 6.熟悉 ISO 26262 功能安全規範，並導入車規元件與安全設計。

1. 硬體電路設計與開發 • 根據專案需求進行系統架構規劃與電路設計（數位、類比、高速訊號） • 繪製原理圖（Schematic）與零件選型 • 與 PCB Layout 工程師合作進行電路板設計與佈線優化 • 評估並引入新技術與元件（CPU、GPU、DDR、Type-C、PD 等） 2. 功能實現與原型驗證 • 製作與驗證原型機（Prototype / EVT） • 分析與解決電路功能異常、訊號完整性（SI）及電源完整性（PI）問題 • 測試高速介面（USB, PCIe, HDMI, DP, Thunderbolt）與相容性驗證 • 優化功耗與散熱設計 3. 測試與驗證 • 制定並執行硬體測試計畫（功能測試、效能測試、穩定性測試） • 協助進行安規（EMI/EMC）、安規認證（UL、CE、FCC 等） • 進行系統相容性測試（各型周邊裝置、作業系統） • 與測試團隊合作分析並修正問題 4. 跨部門專案協作 • 與機構工程師（ME）協調 PCB 尺寸、元件擺放與散熱方案 • 與軟體工程師（SW）共同除錯（Debug）與韌體開發支援 • 與專案經理（PM）對齊時程與需求 • 與供應商（ODM/OEM/零件廠）討論設計、良率與成本 5. 量產支援與問題解決 • 支援試產（PVT）與量產（MP）階段的硬體異常分析 • 協助改善製造良率與穩定性 • 處理現場生產問題（SMT、組裝、測試工站） 6. 文件與版本管理 • 編寫與維護設計文件（原理圖、BOM、設計規範） • 設計變更（ECO/ECN）與版本控制 • 測試報告與問題追蹤（Issue Tracking）

Job responsibilities: 1. 設計連接器的測試治具或簡單小卡線路並與板廠接洽疊構。 2. 負責設計電子電路的原理圖並進行PCB佈局和佈線，確保電路符合設計要求。 3. 根據電路設計需求，選擇合適電子元件，並針對新元件和供應商進行評估。 4. 網路分析儀操作使用。

SSD Hardware Design and Verification: Job responsibilities: SSD HW SI/PI/EMC design and verification quality assurance. 1.SSD HW circuit and PCBA board level design and assembly. 2.Component-level selection and verification. 3. Driver-level SI/PI/EMC design and verification. 4. System-level compliance verification.

Job Overview: The FAE at Analog Devices works closely with experienced IC product definers, applications engineers, and marketing teams. Your role impacts next-generation semiconductors, pushing the boundaries of what’s possible. 1. Customer Design Support Provide technical support to automotive customers throughout pre-sales and post-sales phases, assisting with IC integration into embedded systems including microcontrollers, communication bridges, and ADAS SoCs. 2. Embedded Development & Integration Support customer teams with firmware bring-up, driver configuration, and communication protocol setup (e.g., CAN, LIN, Ethernet). Share sample code and integration guidance to streamline development and validation. 3. System Debug & Issue Resolution Diagnose and resolve issues spanning firmware, protocol communication, and system behavior. Collaborate with customer and internal engineering teams to identify root causes across software and hardware layers. 4. Hardware Interface Collaboration Interpret schematics, support pin configuration, and advise on system-level integration to ensure reliable operation of power, clocks, I/O, and communication interfaces. 5. Technical Training & Documentation Deliver technical presentations, workshops, and training sessions. Produce reference designs, application notes, and setup guides to support adoption and effective use of products. 6. Feedback Loop & Product Improvement Capture customer insights on performance, usability, and requirements. Work with engineering and product teams to enhance IC solutions, tools, and roadmaps.

1. 主動式電子掃描陣列 (相控陣列) 射頻元件及電路板佈局設計。 2. 評估與天線、熱控、電源、及機構之整合相容性，並進一步除錯和優化。

Purpose of this Position 深入研究高速訊號，在高速硬體電路Signal Integrity上提供最佳設計且確保生產品質 Major Areas of Responsibility 專案研發 - Perform high speed signal integrity simulation including 10G/40G、25G/100G、PCIE、SATA、DP、USB、DDR3/DDR4/DDR5. - Perform pre-layout, layout constraint, and post-layout simulation processes. - PCB stackup design and layout review for high speed signal and PDN. - Build component models to ensure the correlation between SI/PI simulation and measurement. - Solid SI experience in resolving technical issues and performing detailed analysis. 團隊合作 - Collaborating with EE teams to refine high-speed signal performance. - Collaborate with the layout engineer to provide clear layout guidelines and enhance footprint optimization.

1. 熟悉電子電路設計，具原理圖繪製與PCB Layout協同經驗 2.能獨立規劃與設計 Router、AP、Layer3 Switch、FWA CPE 等網通產品主板 3.了解常見電源架構設計（DC/DC、PoE、LDO 等） 4.具備 EMI/EMC、ESD 設計與除錯經驗 5.能協助產品從 EVB → EVT → DVT → PVT → MP 轉換流程 6. 負責產品驗證及除錯改進及量產可製造性評估 7. 產品維修SOP製作或生產標準的改良方案，以達到在設備性能限制下的最佳品質。 8. 協助驗證電子零件及產品BOM審核 9. 工作態度正向主動積極

1.負責產品之硬體設計、測試驗證(HW EUT)及除錯等工作，以及開發過程之文件產出。 2.負責產品需求的硬體架構之研究、規劃，新元件之搜尋驗證，及PCBA 成本估算等。 3.熟高速訊號(PCIe Gen4/5, Thunderbolt)及x86主板

1.新產品硬體開發相關作業 2.產品硬體設計驗證。 3.零件承認。 4.新產品技轉作業。 5.其他主管交辦任務。