1.Dsn netsin and Dxfin brd.
2.PCB Component All Placement in作業.
3.完成Net Routing &Drc清除 and tune length作業.
4.Brd Gerber out and Check等案子實作.
5.跨部門溝通協調
1.GO to Market” strategy on defining product package by vertical/territory with pricing strategy.
產出產品上市之市場展開計畫,包含定義不同區域的產品組合與定價策略
2.Plan and manage product launch – plan the launch of new products and manage the cross-functional implementation of the plan.
管理產品上市計劃– 執行與管理新產品上市計畫與確認跨部們的產出時程與上市目標一致
3.Create worldwide product communication package including product positioning, unique selling proposition, counter strategies and deliverable message to the market.
產出產品定位,特色與市場區隔之業務行銷文件
4.Market intelligence – Conducted deep-dive analysis on market trend, competitors and voice of customers.
市場情報-對市場趨勢,競爭對手和客戶回饋進行深入分析