「類比IC設計資深工程師」的相似工作

1. Main responsibility is to design analog IPs in MCU such as adc/dac, pll, osc, por, ldo 2. 具備DC-DC Converter, Buck相關電路設計 2. Responsible for analog IP design, verification plan, test plan, document 3. Communicate with system, layout and digital engineer to ensure high quality --------------------------------------------------------------------------------------- 雅特力科技創立於2016年，為智原科技子公司。 【Artery雅特力】即將在台上市的IC設計公司，主要產品為32bit ARM core base MCU 公司網址：https://www.arterychip.com 關於雅特力：https://www.104.com.tw/company/1a2x6blojm

1. 類比電路設計 2. 主要開發電源管理IC產品 3. DC-DC, Charger-Pump, LDO, PWM, OP相關電路設計 4. Layout 設計規劃

1. 顯示驅動IC 類比電路設計 2. 電源管理IC 類比電路設計 3. 高速介面 類比電路設計 4. 觸控類比前端感測類比電路設計

We are currently seeking a talented Analog Design Engineer to join our team and participate in the development of Power IC for High-Performance Computing (HPC). The role will primarily involve working on the design and development of the following components: 1. PMIC (Power Management Integrated Circuit) 2. Multiphase VR (Voltage Regulator) 3. Buck/Boost/Buck-Boost Converters 4. eFuse (Electronic Fuse)

打造能行走、思考、協作的下一代人形機器人。 羅比芯科技正在研發 RoboChip SoC / IPM 智慧驅動晶片 與 人形機器人關節模組， 結合 GaN 功率電子、MCU 控制、AI 感測與機電整合技術， 我們希望找到對機器人、嵌入式控制與創造有熱情的研發夥伴。 這裡不是流水線開發，而是從「實驗桌」到「產品」， 你將親手打造能讓機器人動起來的智慧驅動核心。 【工作內容】 1.開發與整合 人形機器人關節模組 及 智慧驅動晶片（RoboChip SoC / IPM） 2.設計與測試馬達控制、韌體、感測器與電源系統 3.驗證電路性能、除錯程式邏輯，確保系統穩定與高效率 4.撰寫設計規格書與實驗報告，支援原型製作與Demo驗證 5.參與跨領域討論（機構、控制、韌體、AI感測），共同解決研發挑戰 【技術方向可依專長分流】 電力電子方向 → GaN 功率模組、電源拓樸、驅動與保護電路 控制韌體方向 → MCU（STM32）開發、PWM控制、FOC演算法、SPI通訊 機電整合方向 → 馬達 / 編碼器 / 減速器 / 感測器整合與校正 【條件需求】 電機、電子、機械、控制、資工或相關科系畢業 熟悉 C / Python / MATLAB / PCB Layout 任一項尤佳 對機器人控制與智慧驅動系統具高度熱情 具創業精神與解決問題的勇氣，願意從 0 開始實作、測試、調整 【加分條件】 有 STM32 / Jetson / ROS2 開發經驗 曾參與機器人、無人機、AMR 或電控系統專案 具 Startup / Maker 經驗者佳（動手、整合、跨界） 熟悉控制演算法、感測融合或嵌入式通訊架構者尤佳 【我們提供】 可直接參與 RoboChip SoC / IPM 核心研發，見證技術從構想到量產 參與 Prototype 製作、系統測試與整機整合 開放式研發空間（台科大國際大樓育成中心） 彈性上下班、跨領域學習環境 研發獎金、專利獎勵與技術股制度 【工作地點】 台北市大安區基隆路四段 43 號 國立臺灣科技大學國際大樓育成中心 【我們的文化】 在羅比芯，你不只是工程師，而是技術的共創者。 我們相信： 最好的技術不是寫在簡報裡，而是能讓機器人真的「動起來」。 如果你想讓自己的設計出現在未來的人形機器人裡， 這裡，就是你起步的地方。

1.類比/電源管理 IC電路設計. 2.參與LCD PMIC, LED Driver專案. 3.DC-DC, Charger-Pump, LDO, OP, DAC,ADC相關電路設計

Overview: The Senior High Voltage LNDMOS Device Engineer at Diodes, Inc. leads the design and development of advanced power semiconductor devices. This role focuses on enhancing LNDMOS technology to deliver reliable and efficient solutions for automotive, industrial, consumer, and renewable energy applications. By combining device physics with practical manufacturing, the engineer ensures high-performance products that meet industry standards. Key Responsibilities: • Device Design: Develop high-voltage LNDMOS devices using CAD/TCAD tools, optimizing performance and reliability. • Process Integration: Work with process teams to define fabrication flows and ensure manufacturability and yield. • Characterization: Conduct electrical and reliability testing; analyze data to improve device performance. • Technology Innovation: Explore new structures and materials to enhance LNDMOS capabilities. • Failure Analysis: Investigate device issues using diagnostic tools; provide solutions and improvements. • Cross-functional Collaboration: Coordinate with design, process, test, packaging, and product teams. • Documentation: Prepare technical reports and present findings to stakeholders. • Product Qualification: Support reliability testing and ensure compliance with standards. • Yield & Cost Optimization: Analyze production data to improve yield and reduce costs. • Technical Support: Assist application teams and customers with device integration and troubleshooting. Qualifications: • At least 10 years in power semiconductor device engineering, focusing on high-voltage LNDMOS or LDMOS design and fabrication. Experience with IGBT or SiC/GaN MOSFETs is a plus. • Skilled in device/process simulation tools (e.g., Sentaurus, Atlas). • Solid understanding of semiconductor physics, breakdown mechanisms, and reliability. • Practical experience in wafer fabrication, cleanroom operations, and device testing. • Familiar with advanced failure analysis tools and techniques. • Knowledge of reliability standards and ruggedness requirements. • Proficient in statistical analysis and data-driven problem solving.

1. 類比IP相關功能的設計與實現 ADC, DAC, OSC, PLL, high speed interface...etc. 2. 類比IP設計方法和品質改進 3. 類比IP仿真與分析 4. 與第三方類比 IP 供應商合作 5. 與數位電路作co-sim

Job desicription: Our Design Team specializes in the challenging field of Non-Volatile Memory (NVM) IC circuit design. We are actively seeking an experienced Analog Circuit Design Engineer to contribute to our cutting-edge developments in embedded NVM solutions and surrounding circuitry. As a key member of our team, you will be responsible for the design, verification, and debugging of essential analog building blocks like Bandgap references, LDOs, and Charge Pumps. A significant part of your role will involve designing critical memory peripheral circuits for NVM IP and test chips, including Array interfaces, Decoding logic, and Sense Amplifiers. Your responsibilities will span the design lifecycle, from contributing to IP specifications and core circuit design to ensuring performance through layout optimization and comprehensive corner simulations of NVM IPs. We are looking for candidates with proven expertise in analog circuit design, ideally with prior experience in embedded memory or NVM technologies. If you are an experienced analog designer eager to tackle complex challenges in non-volatile memory, we encourage you to apply and help shape the future of memory technology.

5G手機,AR,VR 顯示技術,AI 人機介面的3D觸控顯示技術,整合生物特徵的全面屏顯示技術。 【工作說明】 1. 高速介面的電路評估,規劃,設計與驗證. 2. 低功耗,高速的SRAM電路評估,規劃,設計與驗證. 3. 高精度,低溫漂的時脈電路評估規劃,設計與驗證. 4. 低功耗,快速嚮應的regulator 電路評估,規劃,設計與驗證. 5. 非揮發性記憶體電路評估,規劃,設計與驗證. 6. 高效率 DC/DC circuit design評估,規劃,設計與驗證. 7. 低功耗,低偏移的OPAMP電路評估,規劃,設計與驗證. 8. 低雜訊的DAC/ADC電路評估,規劃,設計與驗證. 【必要條件】 研究所以上相關科系畢業 熟悉類比電路設計,混合信號處理, 對類比電路設計充滿熱忱者

- Responsible for entire analog design implementation that covers design specification, design creation, integration and optimization to layout review, final post-layout simulation, silicon characterization and system test and debug. - Experience in analog IP development that include SERDES, ADC, DAC, Audio Codec, PLL, IO, memory, analog blocks and high speed PHY for 130nm, 90nm and below technologies. - Knowledge in high speed PHY design (PCIE, USB, GbE, DDR, ETHERNET) is an added advantage. - Preferably done some test characterization, measurement and compliance in previous employment

1.high-speed Tx/Rx interface (Displayport /P2P /MIPI)、PLL特性驗證 2.系統應用導入，進行效能分析、調校，以及問題排除 3.IC量產測試問題分析與良率改善 4.工作地點：新竹

一起打造人形機器人的「心臟」。 在羅比芯科技，我們開發新一代 智慧驅動晶片（RoboChip IPM / SoC）， 結合 GaN 功率元件、MCU 控制、熱設計與機電整合技術， 目標是讓機器人「動得更流暢、能量更高效、體積更小巧」。 我們正在尋找一位能與晶片設計、韌體、機構團隊協作的電力電子工程師， 從原理、模擬到實作，一起設計能真正推動機器人四肢的核心動力模組。 【工作內容】 1.開發 人形機器人關節模組驅動電路 與 IPM 功率拓樸（GaN 為主） 2.設計驅動與保護電路（OVP / OCP / SCP / OTP） 3.進行 效率模擬與波形分析（LTspice / PLECS / 測試平台驗證） 4.協助 SoC 團隊定義 IPM 功率級架構與通訊介面 5.驗證 Prototype 與撰寫測試報告、技術規格書與 BOM 6.若有興趣，也可參與 封裝與熱路設計討論（跨部門協作） 【條件需求】 電機、電子、控制、能源或相關工程背景 熟悉功率電子或馬達驅動電路（如半橋、全橋、LLC、Buck、FOC 等） 具 GaN / MOSFET / Driver IC 電路設計與實測經驗 能使用 PLECS、LTspice、PSIM 或等效模擬工具 【加分條件】 具人形機器人、無人機、伺服馬達、AMR 或電驅動系統開發經驗 熟悉 STM32 / PWM / SPI / FOC 控制架構 有 PCB Layout 經驗（Altium / KiCad） 熟悉熱管理或封裝整合尤佳 【我們提供】 可直接參與 RoboChip SoC / IPM 核心模組開發 彈性上下班與開放式實驗環境（台科大國際大樓育成中心） 可與機械 / MCU / 封裝 / 韌體工程師協同設計 提供研發獎金、專利獎勵與技術股制度 【工作地點】 台北市大安區基隆路四段 43 號 國立臺灣科技大學國際大樓育成中心 【關於我們】 羅比芯科技（RobiChip Technology Co., Ltd.）專注於 機器人智慧驅動晶片與關節模組 的開發。我們整合 GaN 功率技術 × 控制韌體 × 封裝熱設計， 打造高效率、低功耗的智慧動力核心， 應用於 人形機器人、無人機、與自動化設備。 加入我們，讓你設計的不只是電路，而是機器人的「心跳」。

※實際任用職稱依個人相關經歷敘薪。 1. 熟悉Display Driver IC 原理. 2. 可獨立完成Charge Pump design. 3. 可獨立完成Band Gap, Regulators , LDO circuit design. 4. 熟悉類比電子電路專業知識如OP-AMP的設計 5 .個性主動積極、熱誠 、樂觀 . 6. 8~10年經驗 7. mipi. lvds frontend 設計與 debug 經驗尤佳

Job description Join our innovative team specializing in cutting-edge embedded memory solutions. We are seeking Analog Circuit Engineers to play a key role in the design and development of high-performance embedded DRAM and associated peripheral circuits. In this position, you will be responsible for the complete cycle of DRAM circuit design and simulation verification. Your tasks will involve developing novel circuit topologies, transistor-level design, optimizing performance metrics, and ensuring robust functionality through extensive simulations using industry-standard EDA tools. Required qualifications include a strong technical background in Electrical Engineering, Electronics Engineering, Computer Engineering, Physics, or a closely related field. Candidates must possess demonstrated, significant experience in DRAM circuit design and comprehensive simulation verification methodologies. Ideally, candidates will have proven design experience in specific DRAM-related circuit blocks, including but not limited to: Row and Column Decoder circuits Control path logic DC-DC converters, Charge Pumps, and Bandgap References Delay Locked Loops (DLLs) and Phase Locked Loops (PLLs) Negative voltage generators (NVG) and other critical peripheral circuits This is an excellent opportunity to contribute to state-of-the-art embedded memory designs in a dynamic, collaborative environment. If you are a skilled analog designer passionate about solving complex challenges in DRAM circuitry, we encourage you to apply and help shape the future of embedded memory technology.

1.微波與功率元件開發工程師，開發並設計新元件 2.設計磊晶與元件結構 3.定義與安排元件特性測試 4.分析元件特性 5.釐清工程問題

1. Power module/PMIC/MOS/GaN package design. 2. Substrate and leadframe and Cu clip design 3. Customized package design 4. Electrical & thermal simulation through Q3D & IcePAK 5. Co-work with process engineer to solve process and reliability 6. Define thermal resistance through T3Ster measurement or simulation

1.Designs IC sockets and components using design tool provided. 2.Conduct performance forecast, simulation, and analysis 3.Modifies drawings based on NBOs. 4.Measures locally made parts and customer packages. 5.Measures IC socket and components. 6.Translates engineering documents into English (by special assignment). 7.Verifies customer package drawing to existing socket drawing. 8.Modifies and assembles parts for IC sockets. 9.Act as global engineering members. 10.Provides technical support for Sales, field support as needed. 11.Provides technical support to customers through phone, email, and on-site Work. 12.Interacts with vendors on issues of piece parts manufacturing. 13.Provides quality check for assembly and piece parts. 14.Test new products. 15.Improve design quality and speed.

【成為円星人】 円星科技由一群專業與充滿熱情的夥伴創立於2011年，為積體電路矽智財設計服務業之新秀，秉持著『成為半導體業最值得信賴之IP公司』的願景，追求永續經營與成長。 誠摯歡迎您成為円星人，加入我們，站上國際舞台！ 一起共同打拚，以精品文化之精神，創造價值，追求卓越！ 【職務簡介】 M31主要業務為向 IC 設計業者和晶圓代工廠授權 IP，此職務為負責IO電路設計相關之職缺。 【將負責的工作內容】 1. ESD/Latch-up防護設計與驗證 2. I/O電路設計 (Fail safe, Tolerant, Cascade) 3. 高速IO 電路設計 (DDR, ONFI, SDIO) 4. LDO/POR/VDT 電路設計 5. XTAL oscillator 電路設計 6. Analog circuit, IO, PISI, ESD Basic/Advanced Knowledge 【條件與特質】 1. Analog circuit, IO circuit design and simulation 2. 擅長工具-SPICE, Virtuoso 3. 有IO 相關工作經歷3年以上, Analog/IO Basic/Advanced Knowledge 如果您有以上相關經驗且對此職缺有興趣，歡迎投遞您的履歷！

1. MSEE is required. 2. Solid background in analog integrated circuits. 3. Knowledge of high speed serial link technology. 4. Familiar with SerDes PHY (USB, PCIE Express, SATA and Thunderbolt) and building block (DFE, CTLE, CDR, PLL and FFE transmitter). 5. Experience in design and simulation high speed transceiver is a plus.