•Design multilayer PCBs for camera, thermal, LiDAR, LRF, and gimbal modules
•Collaborate with IC engineers to implement signal routing and power delivery
•Perform schematic capture, layout, and DFM/DFT reviews
•Validate board performance through EMI/EMC and thermal testing
•Support rapid prototyping and production ramp-up
Focus: Electrical design and integration of camera/sensor modules into PCBs.