「聲學/AE Engineer (Acoustic)(配合專案出差)(CPD-X)」的相似工作

1. 揚聲器設計工作經驗3 年以上 2. 熟悉使用KLIPPEL量測系統 3. 有廣播系統相關經驗

1. 聲學硬體架構設計與電路繪製。 2. 聲學硬體電路驗證及除錯。 3. 聲電迴路、聲學元件相關音頻品質測量、頻率響應、THD、串擾、諧波分析相關設計驗證。 4. 成品電聲相關驗證，與ID、EE、ME、FW、SW、聽力師以及製造相關單位等合作進行專案設計與設計驗證。 5. 產線聲學測試系統規劃與驗證。

1. 負責視訊產品的 聲學設計研發、測試、調適、分析與改善 2. 主導及規劃視訊產品的 聲學研發設計 3. RFI/RFQ 報價以及方案評估與建議 4. 產品的樣品製作及產線相關問題的分析與解決 5. 新產品導入，量產前的準備，技轉 6. 跨部門溝通協調,建立及改善產品製程技術的優化 7. 聲學相關零件之研究與應用

【Job Description】 As an audio engineer, you will be responsible for the acoustical qualification & audio performance enhancement of the PC systems & peripherals of our industrial customers. Based on your analysis of the game's soundtracks and audio design, and a company shared knowledge of game play, and our gamer's insights, you will provide the best suited Parametric EQ profiles for the top played games. 【Key Responsibilities】 • Measuring the acoustical performances of laptops & headsets • Tuning the dedicated audio processing chain of our products to enhance the overall acoustical performance of these materials • Handling the discussions related to acoustical quality & audio correction directly with the audio team of OEM/ODM • Delivering acoustical qualification reports & audio correction parameters to the OEM/ODM for test & validation • Running onsite tuning with OEM/ODM and technical meetings (possible abroad) • Delivering the validated audio correction parameters to the Driver Engineer for integration in our products • Managing the audio correction database • Helping to continuously improve our products, processes & tools (SW & HW) related to audio performance enhancement • Performing watch activities related to the programs of the top PC industry players (Intel, AMD, Microsoft, Amazon, etc.), especially regarding new audio requirements & specifications • Tuning Parametric EQ Presets for the top played Games • Tuning for Steelseries headset and other audio product • Working independently with various teams across different regions 【Required Qualifications】 This is an Equal Opportunity Employment (EEO). We welcome all candidates who meet the following qualifications: • Bachelor's degree (or equivalent) in acoustics or audio engineering related field • 2+ years of working experience within the consumer electronics market • Knowledge & know-how in measuring acoustical performances (sound level, frequency response, THD, etc.) • Knowledge & know-how in using audio processing FXs (EQ, DRC, etc.) & high-level design of audio processing chains • Knowledge & know-how in electro-acoustical design & problematics • Strong passion in audio and motivated by the transformational effects of technology-at-scale • Curiosity, open to new ideas & quick to learn new skills • Ability to operate in a collaborative, team-oriented culture • Ability to work autonomously and multi-task effectively • Knowledge & know-how in audio DSP is a plus (biquad, FFT, etc.) • Knowledge & know-how in software programming is a plus (Matlab, Python, C/C++, etc.)

1.喇叭單體設計及功能驗證 2.產品系統設計驗證與優化 3.競品分析與現有產品優化 4.針對電聲專業進行跨部門的教育訓練與溝通協調 5.電聲產品量測與法令規範的研究與分析 6.其他主管交辦相關工作事宜

The Role: This position will be on-site at the Logitech office in Hsinchu, Taiwan. You will be a member of our global Acoustics team working on audio projects across multiple product categories. Your primary focus will be new product development including design, validation, and certification as a member of cross functional teams. Your Contribution: Be Yourself. Be Open. Stay Hungry and Humble. Collaborate. Challenge. Decide and just Do. Share our passion for Equality and the Environment. These are the behaviors you’ll need for success at Logitech. In this role you will: • Lead projects for acoustic development and implementation of hardware across speaker, headsets and voice communication devices • Work with transducer developers to optimize performance • Collaborate with ME, EE, FW, DSP teams to optimize audio integration • Characterize audio systems using objective and subjective metrics to ensure the desired end user experience • Collaborate with the algorithm developers to optimize audio/voice performance and tunings • Partner with Engineering/ In-house operation/ OEM/ODM/CM to resolve manufacturing issues • Mentor other engineers

【工作職責】 1. 協助整合空間音效演算法與藍牙音訊Codec（ LHDC）。 2. 協助硬體平台（如Qualcomm、MTK等）應用調教與效能測試。 3. 解決客戶端之音訊相關技術問題。 4. 撰寫技術文件、整合指南、測試報告與客戶問答（FAQ）文件。 5. 協助收集需求與市場趨勢，提供產品優化建議。 6. 定期參與與客戶的技術簡報與教育訓練會議。 【需求技能】 *熟悉藍牙音訊協定（A2DP, HFP, LE Audio）以及音訊Codec（SBC / AAC / LC3 / aptX / LDAC / LHDC）。 *熟悉音訊測試與分析流程(熟悉 oscilloscope、logic analyzer 等工具尤佳) *有初步firmware除錯能力。 【加分技能】 * 具備藍牙模組調音與射頻基本知識。 * 有調教音訊演算法（如回音消除、波束成形、空間混音）經驗。 * 具備Python或MATLAB音訊自動化測試能力。 * 熟悉USB Audio / Windows / macOS Driver 設定與測試流程。 * 處理跨國客戶經驗。

熟悉 Qualcomm Audio DSP 架構 (如 Hexagon DSP, ADSP/MDSP/SDSP) 及相關開發流程 責任音訊子系統模塊設計、音訊路徑配置、演算法整合並據需據擴展設計/開發文件 進行音訊處理流程的問題分析與效能優化 (如 功耗、延遲、同步) 熟悉 Audio HAL / ALSA / AFE / Audio DSP firmware 開發與調校流程 熟悉 Android 音訊架構 (如 AudioFlinger, AudioPolicyManager) 與 AOSP Audio build system 熟悉 Qualcomm 音訊平台軟體堆疊如: AudioReach / QACT / Audio Calibration Tool / Tuning Tool 等優先 與產品經理討論需求，規劃音訊系統架構與功能路線 協助整合第三方音訊演算法 (如 ANC, VAD, Beamforming) 至 DSP platform 據需擴展 Android framework 模組或更改音訊會訊路徑配置功能 據需編寫單元測試、整合測試設計，確保軟體系統穩定性與品質 【加分條件】 (Preferred Qualifications): 具備 SmartPA 調校、語音觸發 (Voice Activation)、Voice UI 開發經驗 熟悉 Qualcomm SA8155P / SA8295P / Snapdragon Ride 系列平台開發經驗

1.參與空壓機及相關產品的振動與噪音設計、分析與改善 2.進行振動/噪音量測與頻譜分析，制定改善方案 3.建立並優化振動與噪音測試規範與流程 4.支援新產品開發，確保振動與噪音符合國際標準與客戶要求 5.與研發、製造及品管團隊合作，解決生產與現場反饋問題 6.其他主管交辦事項

[General Summary] As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world. As a software engineer at Augentix, you will contribute to the design, development, and validation of embedded device drivers across Linux and RTOS platforms. Your work will enable high-performance imaging pipelines and sensor interfaces for camera-centric products in industrial and edge environments. Senior engineers will play a key role in architecture design, bring-up, system integration, and mentoring junior developers. [Responsibilities] ★ Design, develop, and maintain audio device driver firmware for embedded camera and IoT systems. ★ Implement and optimize real-time audio processing algorithms (e.g., voice enhancement, noise suppression). ★ Analyze and resolve system-level audio quality and performance issues. ★ Maintain and enhance existing DSP frameworks and audio processing chains. ★ Conduct system performance profiling and apply targeted optimizations. ★ Collaborate with cross-functional teams (hardware, systems, driver, and test) to deliver production-ready solutions. ★ Occasional business travel across APAC and other regions may be required. [Minimum Qualifications] ★ Bachelor's or Master's degree in Electrical Engineering, Computer Science, or a related field with 3+ years of relevant experience. ★ Experience in embedded software or DSP firmware development. ★ Proficiency in C programming for embedded systems. ★ Solid understanding of digital signal processing fundamentals with a focus on audio. ★ Experience debugging and optimizing audio pipelines in resource-constrained environments. [Preferred Qualifications] ★ Experience with Linux kernel audio subsystems, particularly ALSA. ★ Knowledge of embedded processor architecture and writing low-latency, real-time code. ★ Hands-on experience with FPGA-based system validation. ★ Familiarity with system-level profiling tools and audio performance tuning. ★ Comfortable working in a globally distributed, cross-disciplinary engineering team.

[職務說明] 作為一位微星NB FAE，你將負責提供全球客戶筆記型電腦上的技術支援並提供解決方案，確保使用者產品體驗。此職務需與內部研發、測試、生產、專案部門等緊密合作，並提供客戶端一線技術協助。 [主要職責] •負責 NB 產品系統及應用相關問題（作業系統、驅動程式、BIOS、韌體等）的技術支援與除錯 •協助進行軟體功能測試、驗證與效能分析 •撰寫技術文件、問題報告及測試報告，並提供簡報支援 •與內部研發團隊合作，追蹤問題至根本原因並提出修正建議 •協助客戶理解產品特性與差異，並提供導入建議與技術說明 •參與競品分析、市場趨勢觀察及客戶需求整理，支援產品開發方向 [必要條件] 技術專業能力： 熟悉筆記型電腦硬體架構（主機板、CPU、記憶體、儲存裝置、顯示器、各式 I/O 接口等） 了解作業系統（如 Windows / Linux）、驅動程式、BIOS、韌體等基本知識 能操作分析與除錯工具，如事件檢視器(Event Viewer)、Log 分析工具等 具備產品規格理解與比較分析能力 基本程式語言理解（如 C/C++、Python、Shell script）有助於問題定義 溝通與協調能力： 能準確理解客戶技術需求並轉化為可執行的內部任務 良好書面與口頭表達能力，可撰寫技術文件並進行簡報 能跨部門協調，與研發、測試、PM 團隊協作處理問題 問題解決與應變能力： 具備定義與分析軟體相關問題的能力 能針對客戶端反應提出具體、可行的解決方案 面對緊急情況具備應變與壓力處理能力 工作態度： 主動積極、對技術細節有高度敏感度與熱忱 樂於協助他人並具備服務導向思維 良好的時間管理與多任務處理能力 重視團隊合作，願意分享知識與經驗 [加分條件] 具備筆電或嵌入式裝置軟體開發／測試／驗證經驗 熟悉USB、Audio、Display 等系統元件者尤佳 曾與跨國客戶技術協作經驗者優先 英文讀寫能力佳，能閱讀 datasheet 與英文技術文件（TOEIC成績700以上）

 Project platform HW system design integration  EE Schematic design  PCB layout design and review  RFQ/PRD research and feedback  Component survey and technology study  Bom creation and maintain  EE circuit/system design developing , validation and debugging.

UltraSense Systems, headquartered in Silicon Valley, is revolutionizing human-machine interfaces (HMI) through its cutting-edge SmartSurface technology. Our InPlane Sensing platform seamlessly integrates touch, lighting, and haptic feedback into everyday surfaces, delivering intuitive, responsive, and premium user experiences across automotive, consumer electronics, and other industries. Join our mission to create the next generation of smart, touch-sensitive surfaces that are both functional and aesthetically superior. Summary UltraSense Systems is seeking a creative Senior Engineer, Ultrasound Algorithm Development to help develop the prototype of a groundbreaking new product. In this role, you'll collaborate with a high-caliber team to design and build devices that break new ground in the industry. This role involves hands-on algorithm development, acoustic signal processing, and system development. Key Responsibilities ．Lead design, development, and prototyping of ultrasound sensor systems—from concept through testing and iteration (inspired by Xwave Innovations roles) ．Develop, implement, and optimize acoustic signal processing algorithms, including beamforming (phased array/delayandsum), synthetic aperture techniques, and advanced array processing ．Write clean, efficient, well-documented Python code for simulation, modeling, and real-time signal acquisition/processing ．Build and integrate prototype hardware and firmware components (e.g., piezoelectric transducer interfacing, digitizers, array electronics) ．Conduct simulations, modeling (e.g., FEA or acoustic propagation), and validation testing; iterate to improve system performance ．Analyze sensor data, benchmark performance metrics, debug acoustics chain (from raw signals to processed outputs), and refine algorithms and hardware　accordingly ．Collaborate with cross-functional teams—mechanical, electrical, software—to define system requirements and drive integrative design (common across R&D roles) Minimum Requirements ．Degree: M.S. or Ph.D. in Electrical Engineering, Acoustics, Computer Science, Applied Physics, or a related field ．Hands-on experience (3–5+ years) in acoustic/ultrasound signal processing or sensor systems, including beamforming and array processing (phased arrays, delay-and-sum, synthetic aperture, etc.) ．Strong proficiency in Python for algorithm development, data analysis, and simulation (e.g., with NumPy, SciPy, MATLAB not essential but a plus) ．Practical experience with prototyping hardware—working with transducers, pulser/receiver logic, data acquisition systems, or similar instrument interfacing ．Solid understanding of acoustic wave propagation, ultrasound physics, signal-to-noise enhancement techniques, and array signal processing principles ．Excellent communication, writing, and documentation skills; ability to draft technical reports, collaborate with teams, and present findings clearly (noted across industry postings) Desired Requirements ．Ph.D. in relevant field, with a proven R&D track record, including publications, patents, or conference papers ．Experience with FEA modeling or acoustic simulation tools, especially for transducer design or wave propagation analysis ．Background in device fabrication, CAD design, or microelectronic processing (e.g., GDS patterning) is a plus ．Familiarity with synthetic aperture ultrasound techniques or advanced imaging methods ．Experience developing adaptive or data-driven beamforming (e.g., deep learningenabled approaches for ultrasound) ．Proficiency in embedded platforms or real-time firmware, including porting signal processing algorithms into C/C++ or FPGA/ASIC environments ．Proven ability in small R&D environments—self-motivated, resourceful, and highly collaborative ．Comfortable working in a fast-paced, cross-functional environment ．Creative thinker with a passion for tackling unfamiliar challenges ．Eagerness to contribute to early-stage product innovation and development

(一)承接模擬分析專案 (二)專案人員之分配.專案進度掌控,後續研發流程之追蹤。 (三)以模擬的角度，參與設計審查與設計驗證檢討。 (四)新分析技術案例蒐集及彙整。 (五)CAE軟體二次開發程式撰寫 (六)材料實驗規劃及實驗後數據處理 (七)實驗規範蒐集及彙整 (八)完成上級臨時交辦事項。

負責公司內部 AI 應用的開發、整合與推廣，協助各部門導入 AI 技術以提升營運效率與創新能力： -設計、開發並維護 AI 模型與系統（如 NLP、Computer Vision、Recommendation Systems 等） -與業務單位合作，了解需求並提出 AI 解決方案 -整合 AI 技術至現有系統與流程中（如 ERP、CRM、客服系統等） -研究並評估最新 AI 技術與工具，提出導入建議 -建立 AI 使用標準與最佳實踐，推動公司 AI 化文化 -協助內部教育訓練，提升員工對 AI 的認識與應用能力 *依公司安排，需可配合公司出差海外工廠跟進相關專案。

1.組裝製程開發與設計驗證 2.與客戶溝通檢討產品規格與製程規劃 (優化產品組裝流程 ) 3.新產品開發量試、導入量產及良率提升 4.產品DOE設計及驗證 5.主導機構件品質異常FACA 6. 新技術及新加工法之開發, 協助完成部門目標 7. 熟悉UG&Solidworks軟體操作尤佳

1. 負責Video conference產品系統設計與硬體設計工作。 2. 負責 Video conference專案的開發、測試及量產工作。 3. 參與客戶會議討論並協助澄清設計相關問題。

1. 國外客戶開發,聯繫及維護. 2. 專案進度管理與掌控. 3. 具業務簡報技能. 4. 針對客戶提出的合約（交易條件、生產流程、產品要求、售後服務）作初步評估， 5. 銷售預估,年度目標達成. 5. 對電競週邊產品、ODM/OEM客戶通路開發有經驗及興趣者，

1. Support customer projects from design-in, design-through to mass-production. 2. Team work with AE, FAE, RD and QA to solve problems.

1.產品開發熱系統設計 2.散熱系統Guideline建立 3.產品性能驗證 4.其他主管交辦事項