[General Summary]
As a forward-thinking technology company, Augentix advances the limits of innovation in "Industrial and Embedded IoT" to deliver next-generation experiences and accelerate digital transformation toward a smarter, more seamlessly connected world.
We are seeking a PCB Design Engineer with strong theoretical foundation and simulation driven design methodology to lead high speed board level development. You will be responsible for defining and verifying board level electrical design, ensuring optimal signal integrity across multiple high speed interfaces. You will be supported by experienced layout engineers capable of implementing your design guidance and constraints, allowing you to focus on PCB circuit design and system validation. This position offers the opportunity to build structured PCB design practices, improve team capability, and drive electrical excellence through direct ownership of simulation and cross team collaboration.
[Responsibilities]
★ Lead system level PCB electrical design for interfaces such as LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet.
★ Define PCB stack up and routing strategy to meet signal integrity objectives.
★ Perform circuit level simulations using tools such as PSpice.
★ Own schematic level electrical planning and define layout constraints for critical signal groups.
★ Provide guidance to supporting layout engineers to ensure adherence to electrical rules and best practices.
★ Correlate simulation results with lab measurements and assist in electrical issue root cause analysis.
★ Document simulation methodology constraint guidelines and validation reports.
★ Occasional business travel across APAC and other regions may be required.
[Minimum Qualifications]
★ Familiarity with differential and single ended routing across LPDDR4/5, USB 3.x, SDIO 3.x, MIPI and Ethernet.
★ Proficiency with layout tools such as Allegro.
★ Exposure to EMI mitigation techniques and hands on experience in EMI pre compliance testing.
★ Demonstrated ability to lead layout teams or mentor junior engineers in constraint based PCB design.
★ Ability to create structured documentation and design guidelines to scale internal processes.
★ Strong debugging and problem solving skills with working knowledge of firmware and software to support system level root cause analysis.
★ Comfortable working in a globally distributed, cross-disciplinary engineering team.
1. Flip chip package substrate design.
2. Capable provide optimization design proposal.
3. Capable to co-work with substrate/material suppliers directly.
4. Design rule maintenance.
5. Work closely and Interface with various teams (product, PE group and supplier…etc)
6. A plus for Good command of written and oral in English.
1.Analog and mixed mode circuit layout and verification
2.Co-work with designer for layout floor planning,routing and physical verifications
3.command file maintain