1. Develop the embedded firmware for various serdes products
2. Troubleshooting and debugging with customers or cross-team members.
3. Strong coding skill in Python, C and C++ language.
4. Good knowledge in micro processor
4. Good knowledge in operating system and software engineering
5. Good knowledge in hardware and chip design
6. Business trip for training, debugging or co-development with chip designers (To US headquarter or Shanghai office)
This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip)
1.Package RFQ and structure & BOM selection.
2.Direct material evaluation and survey.
3.FA and Reverse Engineering.
4.Package design rule maintain & update.
5.Advance products design / NPI projects development.
6.Research & setup package roadmap / material roadmap.
1. 具 0~2年數位晶片設計,或有 0~5年類比晶片設計工作經驗。
2. 具備基本數位和類比電路知識,熟習標準晶片設計流程。
3. 熟習業界常用EDA tools, 或Matlab/ Simulink。
4. 研習過CMOS or BiCMOS 類比設計電路課程,對放大器有基礎認識。
5. Experience in these areas is preferred:
* BiCMOS or CMOS high-speed (>20Gb/s) circuit, Linear electrical amplifier &
equalizer, High-speed (>25G) CDR/PLL/SerDes.
* Linear optical laser driver & receiver (TIA + linear amplifier)
本職位負責類比IC電路的設計、驗證和除錯。這是一個高度技術性的職位,對公司的產品開發至關重要。我們正在尋找一位熱愛類比IC設計並具有相關經驗的人才,以推動公司的技術創新和發展。
如果您對這個職位感興趣,請投遞您的履歷表,我們立即與您聯繫。
1.Designs IC sockets and components using design tool provided.
2.Conduct performance forecast, simulation, and analysis
3.Modifies drawings based on NBOs.
4.Measures locally made parts and customer packages.
5.Measures IC socket and components.
6.Translates engineering documents into English (by special assignment).
7.Verifies customer package drawing to existing socket drawing.
8.Modifies and assembles parts for IC sockets.
9.Act as global engineering members.
10.Provides technical support for Sales, field support as needed.
11.Provides technical support to customers through phone, email, and on-site
Work.
12.Interacts with vendors on issues of piece parts manufacturing.
13.Provides quality check for assembly and piece parts.
14.Test new products.
15.Improve design quality and speed.
Job description
Join our innovative team specializing in cutting-edge embedded memory solutions. We are seeking Analog Circuit Engineers to play a key role in the design and development of high-performance embedded DRAM and associated peripheral circuits.
In this position, you will be responsible for the complete cycle of DRAM circuit design and simulation verification. Your tasks will involve developing novel circuit topologies, transistor-level design, optimizing performance metrics, and ensuring robust functionality through extensive simulations using industry-standard EDA tools.
Required qualifications include a strong technical background in Electrical Engineering, Electronics Engineering, Computer Engineering, Physics, or a closely related field. Candidates must possess demonstrated, significant experience in DRAM circuit design and comprehensive simulation verification methodologies.
Ideally, candidates will have proven design experience in specific DRAM-related circuit blocks, including but not limited to:
Row and Column Decoder circuits
Control path logic
DC-DC converters, Charge Pumps, and Bandgap References
Delay Locked Loops (DLLs) and Phase Locked Loops (PLLs)
Negative voltage generators (NVG) and other critical peripheral circuits
This is an excellent opportunity to contribute to state-of-the-art embedded memory designs in a dynamic, collaborative environment. If you are a skilled analog designer passionate about solving complex challenges in DRAM circuitry, we encourage you to apply and help shape the future of embedded memory technology.